Method of indirectly connecting two parts
Patent 4247034 Issued on January 27, 1981. Estimated Expiration Date: 
July 27, 1998. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 27, 1998. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3921885 Surface joining by bonding of metal and deposited metal Techniques for producing an acousto-optical component or a wide-band ultrasonic component Method of indirectly connecting two parts Patent #: 4196837 InventorsApplicationNo. 05/928683 filed on 07/27/1978US Classes:228/116, With pretreating of work228/121, Bonding nonmetals with metallic filler228/221, Vacuum228/235.1, Mode of applying pressure228/262.72Brazing or solderingExaminersPrimary: Ramsey, Kenneth J.Attorney, Agent or FirmInternational ClassesB23K 20/24 (20060101)B23K 35/00 (20060101) C03C 27/06 (20060101) C03C 27/08 (20060101) Foreign Application Priority Data1977-09-23 DEAbstractTwo parts, such as a quartz part and piezo-electric part, are indirectly connected to one another by applying relatively thin metallic layers having a thickness of about 0.5 nm to 55 nm under vacuum conditions onto the surfaces of such parts to be joined and then without ventilation of the vacuum-chamber contacting the free surfaces of such metallic layers with one another under the maintained vacuum conditions whereby a substantially permanent bond is formed between such layer. | |
