Patent References 3655598 3678010 3701815 3823098 3970709 Heat curable organopolysiloxane compositions containing adhesion additives Heat stable organopolysiloxane composition Method for preparing epoxy-modified silicon resins Patent #: 4141926 InventorsAssigneeApplicationNo. 05/973889 filed on 12/28/1978US Classes:525/102, Si-H or Si-C reactant contains an atom other than C, H, O, or Si bonded to a carbon atom525/100, With saturated Si-C or Si-H reactant or polymer thereof; or with solid copolymer derived from at least one Si-C or Si-H reactant wherein at least one of the reactants forming the solid copolymer is saturated; or with SPFI wherein at least one of the necessary ingredients contains a Si-C or Si-H bond or with a reaction product thereof; or with a SICP containing a Si-H or Si-C bond525/342, Chemical treating agent contains a silicon atom528/272, From di- or higher ester of a polycarboxylic acid as sole reactant, or from a polycarboxylic acid or derivative with a compound containing two or more hydroxyl groups or salts thereof528/297, 1,2-epoxy containing reactant528/38Silicon reactant contains an amine nitrogen atomExaminersPrimary: Phynes, Lucille M.Attorney, Agent or FirmInternational ClassesC08G 63/00 (20060101)C08G 63/695 (20060101) Foreign Application Priority Data1977-12-29 JPAbstractA curable polyester oligomer having a molecular weight of between 300 and 10,000 and at least one silyl radical at the side chain or at the end of the molecule, with the silyl radical being represented by the formula: ##STR1## wherein R, R1 and R2 represent hydrogen or any monovalent hydrocarbon radical with 1 to 10 carbon atoms, selected from the group consisting of alkyl radical, aryl radical and aralkyl radical; R3 represents divalent hydrocarbon radical with 0 to 10 carbon atoms, "X" represents any radical selected from the group consisting of halogen, alkoxy, acyloxy, aminoxy, phenoxy, thioalkoxy, and amino radicals; "a" is an integer 0, 1 or 2; and "b" is an integer 0 or 1. | |