Patent References 3436620 3604990 3653978 3846822 Field-effect transistor Charge pumping device with integrated regulating capacitor and method for making same MOS type semiconductor device Patent #: 4143388 InventorsApplicationNo. 05/870216 filed on 01/17/1978US Classes:257/343, All contacts on same surface (e.g., lateral structure)257/336, With lightly doped portion of drain region adjacent channel (e.g., LDD structure)257/E21.25, Etching inorganic layer (EPO)257/E21.251, By chemical means (EPO)257/E21.337, Through-implantation (EPO)257/E21.346, Using mask (EPO)257/E21.417, With channel containing layer, e.g., p-base, fo rmed in or on drain region, e.g., DMOS transistor (EPO)257/E29.04, Of field-effect transistors with insulated gate (EPO)257/E29.066, Body region structure of IGFET's with channel containing layer (DMOSFET or IGBT) (EPO)257/E29.121, Source or drain electrode in groove (EPO)257/E29.133, Nonuniform insulating layer thickness (EPO)257/E29.256, With channel containing layer contacting drain drift region (e.g., DMOS transistor) (EPO)257/E29.257, Having vertical bulk current component or current vertically following trench gate (e.g., vertical power DMOS transistor) (EPO)257/E29.261, With at least part of active region on insulating substrate (e.g., lateral DMOS in oxide isolated well) (EPO)257/E29.279, Asymmetrical source and drain regions (EPO)257/E29.287SOS transistor (EPO)ExaminersPrimary: Clawson, Joseph E. Jr.Attorney, Agent or FirmInternational ClassesH01L 21/266 (20060101)H01L 29/78 (20060101) H01L 21/02 (20060101) H01L 29/66 (20060101) H01L 29/423 (20060101) H01L 29/02 (20060101) H01L 21/336 (20060101) H01L 21/265 (20060101) H01L 29/786 (20060101) H01L 21/311 (20060101) H01L 29/10 (20060101) H01L 29/40 (20060101) H01L 29/08 (20060101) Foreign Application Priority Data1977-01-31 DEAbstractA MIS field effect transistor having a source zone of a first impurity type formed in a semiconductor substrate immediately below one planar surface thereof, a drain zone of the first conductivity type in said substrate spaced from the source zone immediately below said one surface, a third zone, of said first impurity type in said substrate extending between said source and drain zones and extending deeper in said substrate than either said source or drain zones, a thin buried zone of the second conductivity type in said substrate spaced below and around the ends of said source zone, the region of said buried zone where it lies between said source and drain zones providing a channel whose length is only the thickness of the buried zone in the region where the buried zone reaches the substrate surface. A process for producing such a transistor is also disclosed.Other References
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