Method of assembling a hermetically sealed semiconductor unit
Patent 4142203 Issued on February 27, 1979. Estimated Expiration Date: 
December 20, 1996. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 20, 1996. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesInventorAssigneeApplicationNo. 05/752545 filed on 12/20/1976US Classes:257/704, Cap or lid257/703, Composite ceramic, or single ceramic with metal257/729, Portion of housing of specific materials257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.043, Geometry of lead frame (EPO)257/E23.189, Leads being parallel to base (EPO)257/E23.193Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO)ExaminersPrimary: James, Andrew J.Attorney, Agent or FirmInternational ClassesH01L 23/057 (20060101)H01L 21/58 (20060101) H01L 23/02 (20060101) H01L 21/02 (20060101) H01L 23/10 (20060101) H01L 23/495 (20060101) H01L 23/48 (20060101) AbstractHermetically sealed unit containing an integrated circuit metal oxide semi-conductor chip, wherein a single layer gold-silver alloy serves both to secure the chip within the unit and to form a proper junction with the aluminum alloy conductor connected to a circuit element in said chip. A sufficient proportion of silver is included in the gold-silver alloy whereby said junction retains requisite operational characteristics of bond strength and low resistivity when said unit is subjected to heat for providing a hermetic seal therefor. | |
