ApplicationNo. 05/752545 filed on 12/20/1976
US Classes:257/704, Cap or lid257/703, Composite ceramic, or single ceramic with metal257/729, Portion of housing of specific materials257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.043, Geometry of lead frame (EPO)257/E23.189, Leads being parallel to base (EPO)257/E23.193Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO)
ExaminersPrimary: James, Andrew J.
Attorney, Agent or Firm
International ClassesH01L 23/057 (20060101)
H01L 21/58 (20060101)
H01L 23/02 (20060101)
H01L 21/02 (20060101)
H01L 23/10 (20060101)
H01L 23/495 (20060101)
H01L 23/48 (20060101)
AbstractHermetically sealed unit containing an integrated circuit metal oxide semi-conductor chip, wherein a single layer gold-silver alloy serves both to secure the chip within the unit and to form a proper junction with the aluminum alloy conductor connected to a circuit element in said chip. A sufficient proportion of silver is included in the gold-silver alloy whereby said junction retains requisite operational characteristics of bond strength and low resistivity when said unit is subjected to heat for providing a hermetic seal therefor.