Machine for changing the spacing of a plurality of wafers
Patent 4108323 Issued on August 22, 1978. Estimated Expiration Date: 
September 28, 1997. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 28, 1997. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3920128 Semiconductor wafer transfer device Patent #: 3949891 InventorsAssigneeApplicationNo. 05/837419 filed on 09/28/1977US Classes:414/416.02, Changes spacing between articles414/273, With control system responsive to changeable operating instructions414/937Including means for charging or discharging wafer cassetteExaminersPrimary: Sheridan, Robert G.Attorney, Agent or FirmInternational ClassesB65G 65/00 (20060101)H01L 21/677 (20060101) H01L 21/67 (20060101) AbstractA machine for changing the spacing of a plurality of wafers comprises a plurality of wafer receiving surfaces initially having a first spacing associated therewith. The wafer receiving surfaces cooperatively engage with means which, when activated, move the plurality of wafer receiving surfaces so that they have a second spacing associated therewith. | |
