Semiconductor wafer transfer device Patent #: 3949891
ApplicationNo. 05/837419 filed on 09/28/1977
US Classes:414/416.02, Changes spacing between articles414/273, With control system responsive to changeable operating instructions414/937Including means for charging or discharging wafer cassette
ExaminersPrimary: Sheridan, Robert G.
Attorney, Agent or Firm
International ClassesB65G 65/00 (20060101)
H01L 21/677 (20060101)
H01L 21/67 (20060101)
AbstractA machine for changing the spacing of a plurality of wafers comprises a plurality of wafer receiving surfaces initially having a first spacing associated therewith. The wafer receiving surfaces cooperatively engage with means which, when activated, move the plurality of wafer receiving surfaces so that they have a second spacing associated therewith.