Package and method for a semiconductor radiant energy emitting device
Patent 4032963 Issued on June 28, 1977. Estimated Expiration Date: 
June 28, 1994. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
June 28, 1994. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesInventorAssigneeApplicationNo. 683552 filed on 05/05/1976US Classes:257/100, Encapsulated257/680, With window means257/791, Including polysiloxane (e.g., silicone resin)257/E33.059, Encapsulation (EPO)264/135, Molding material against and uniting to the coated or impregnated workpiece264/272.17, Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)438/26Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductorExaminersPrimary: Larkins, William D.Assistant: Munson, Gene M. Attorney, Agent or FirmInternational ClassesH01L 023/28H01L 023/02 H01L 023/12 AbstractMethod and structure for encapsulating or providing a package for a light emitting semiconductor device in order to prevent package failure due to chemical contaminants. A light emitting semiconductor chip is connected to terminal leads having sharp angular portions. The device and the sharp angular portions are coated with a resilient elastomeric resin material inner core. An outer core comprising an acrylic or polycarbonate plastic material is injection molded over the inner core so as to leave exposed terminal leads for interconnection to electrical substrates such as cards or printed circuit boards. | |
