ApplicationNo. 683552 filed on 05/05/1976
US Classes:257/100, Encapsulated257/680, With window means257/791, Including polysiloxane (e.g., silicone resin)257/E33.059, Encapsulation (EPO)264/135, Molding material against and uniting to the coated or impregnated workpiece264/272.17, Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)438/26Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
ExaminersPrimary: Larkins, William D.
Assistant: Munson, Gene M.
Attorney, Agent or Firm
International ClassesH01L 023/28
AbstractMethod and structure for encapsulating or providing a package for a light emitting semiconductor device in order to prevent package failure due to chemical contaminants. A light emitting semiconductor chip is connected to terminal leads having sharp angular portions. The device and the sharp angular portions are coated with a resilient elastomeric resin material inner core. An outer core comprising an acrylic or polycarbonate plastic material is injection molded over the inner core so as to leave exposed terminal leads for interconnection to electrical substrates such as cards or printed circuit boards.