Patent References 3476826 3480584 3499859 3560244 3627722 3632557 3681010 3755252 3776977 3870766 InventorApplicationNo. 05/556495 filed on 03/07/1975US Classes:528/23, Material contains a phosphorus or sulfur atom525/276, Ethylenic reactant contains a fluorine atom525/288, Ethylenic reactant contains atoms other than C, H, O, N, S, or Cl526/279, From monomer containing a silicon atom528/24, Material contains a compound having an O-O group, e.g., peroxide, etc.528/26, Organic Si-free reactant is a carboxylic acid or derivative528/28, Organic Si-free reactant is a nitrogen-containing compound528/901ROOM TEMPERATURE CURABLE SILICON-CONTAINING POLYMERExaminersPrimary: Marquis, Melvyn I.Attorney, Agent or FirmAbstractA room temperature moisture curable composition contains a vulcanizable polymer having at least one terminal trialkoxysilyl group and a catalytic amount of a fluoroaliphaticsulfonyl-substituted ethylene compound. | |