Did You Know...
...that in the early 1940s GE engineer James Wright was charged with a task of utmost importance to the war effort: develop a cheap substitute for rubber that could be used to produce tires, gas masks and a whole host of military gear. Wright tackled the task diligently -- and wound up inventing Silly Putty.
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| Number | Title | Issue Date |
| 8330277 | Semiconductor element built-in device A semiconductor element built-in device includes: a first substrate having a first pad thereon; a semiconductor element on the first substrate; a second substrate having a second pad thereon and mounted on the first substrate via a solder terminal having a solder co... | 12/11/2012 |
| 8274153 | Electronic component built-in wiring substrate In an electronic component built-in wiring substrate, an electronic component is mounted on a first wiring substrate. A second wiring substrate is stacked on the first wiring substrate and is connected electrically to the first wiring substrate by connection termina... | 09/25/2012 |
| 8222747 | Multilayer wiring substrate mounted with electronic component and method for manufacturing the same A multilayer wiring substrate mounted with an electronic component includes an electronic component, a core material layer having a first opening for accommodating the electronic component, a resin layer which is formed on one surface of the core material layer and ... | 07/17/2012 |
| 8096049 | Method of manufacturing a multilayer wiring board First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer board... | 01/17/2012 |
| 8062571 | Resin sealing method in stacked wiring substrate A resin sealing device includes a lower die, an upper die which is arranged over the lower die, on a lower surface side of which a concave portion is provided, and to a bottom surface peripheral portion of the concave portion of which a projection portion projecting... | 11/22/2011 |
| 7994431 | Substrate with built-in electronic component and method for manufacturing the same A substrate with built-in electronic components includes a substrate on which a first conductive pattern is formed; an electronic component mounted on the substrate; an insulting layer which is formed by stacking a plurality of resin layers including indifferent add... | 08/09/2011 |
| 7936061 | Semiconductor device and method of manufacturing the same A semiconductor device includes: a first insulating layer having an opening therethrough; a first wiring pattern disposed on the first insulating layer; an external connection terminal provided on a portion of the first wiring pattern exposed from the opening; a sec... | 05/03/2011 |
| 7923367 | Multilayer wiring substrate mounted with electronic component and method for manufacturing the same A multilayer wiring substrate mounted with an electronic component includes an electronic component, a core material layer having a first opening for accommodating the electronic component, a resin layer which is formed on one surface of the core material layer and ... | 04/12/2011 |
| 7906833 | Semiconductor device and manufacturing method thereof A method for manufacturing a semiconductor device has preparation step of preparing a semiconductor substrate having a plurality of semiconductor chip formation regions and a scribe region arranged between the plurality of the semiconductor chip formation regions an... | 03/15/2011 |
| 7893524 | Wiring substrate and semiconductor device and method of manufacturing the same In a wiring substrate of a semiconductor device, a hollow portion is provided under a pad wiring portion including a connection pad, and thus a wiring layer has a cantilever structure in which the pad wiring portion is formed as an aerial wiring, and a semiconductor... | 02/22/2011 |
| 7882627 | Method of manufacturing a multilayer wiring board First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer board... | 02/08/2011 |
| 7829378 | Method of manufacturing electronic device, substrate and semiconductor device A method includes a step of forming a bump 104 having a projection 104B on an electrode pad 103 provided on a semiconductor chip 101, a step of exposing a part of the projection 104B to an upper surface of an insulating layer 10... | 11/09/2010 |
| 7786580 | Semiconductor device and method for manufacturing the same A semiconductor chip is characterized by a structure including a semiconductor chip on which electrode pads are formed, bumps which are formed on the respective electrode pads and which have projection sections, an insulating layer formed on the semiconductor chip, ... | 08/31/2010 |
| 7772109 | Manufacturing method of multilayer wiring substrate A first multilayer wiring structural body 16 and a second multilayer wiring structural body 56 are simultaneously formed on both surfaces 101A, 101B of a substrate 101 and thereafter the portion of a structural body 120 corr... | 08/10/2010 |
| 7772091 | Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions Alignment patterns are formed in scribe regions of a semiconductor substrate, and through grooves for exposing the scribe regions are disposed in an insulating layer formed on the semiconductor substrate. Formation positions of wiring patterns are aligned based on t... | 08/10/2010 |
| 7663253 | Board having electronic parts mounted by using under-fill material and method for producing the same A board 1 according to the present invention includes a board main body 3; electronic parts 5 electrically connected to and mounted on the board main body 3; and an under-fill material 19 with which a part between the board main bo... | 02/16/2010 |
| 7624501 | Method of manufacturing multilayer wiring board First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board... | 12/01/2009 |
| 7615408 | Method of manufacturing semiconductor device An internal connecting terminal 12 is formed on electrode pads 23 of a plurality of semiconductor chips 11 formed on a semiconductor substrate 35, and there is formed a resin member 13 having a resin member body 13-1 ... | 11/10/2009 |
| 7521283 | Manufacturing method of chip integrated substrate A manufacturing method of a chip integrated substrate is disclosed. The manufacturing method includes a first step that forms a wiring structure to be connected to a semiconductor chip on a first core substrate; a second step that disposes the semiconductor chip on ... | 04/21/2009 |
| 7312536 | Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight ... | 12/25/2007 |
