"Flight by machines heavier than air is unpractical and insignificant, if not utterly impossible."
|8114751||Multi-angle rotation for ion implantation of trenches in superjunction devices|
A method of manufacturing a semiconductor device includes providing a semiconductor wafer and forming at least one first trench in the wafer having first and second sidewalls and a first orientation on the wafer. The first sidewall of the at least one first trench i...
|8012806||Multi-directional trenching of a die in manufacturing superjunction devices|
A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first orientation is formed in the at least one die. At least one second trench having a second orientation that is ...
|7723172||Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material|
Methods for manufacturing trench type semiconductor devices containing thermally unstable refill materials are provided. A disposable material is used to fill the trenches and is subsequently replaced by a thermally sensitive refill material after the high temperatu...