Inventor: Mitsuhiro Masuda

Address: Chiyoda-ku, JP
No. of patents: 2
Last patent issue date: 10/21/2008

Number	Title	Issue Date
7439452	Multi-chip module packaging with thermal expansion coefficiencies In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member a...	10/21/2008
7298039	Electronic circuit device In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a modu...	11/20/2007

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