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Inventor: Hideki Tateishi


Address: Ohta-ku, JP
No. of applications: 1
Last application issue date: 06/08/2006

Application No.Application TitleIssue Date
20060118598Bonding apparatus and bonding method
A bonding apparatus can bond contacts of electronic components directly to each other without the need for solder. The bonding apparatus include a hermetically sealed processing chamber, a plurality of bases for holding at least two workpieces having respective bonding ... 		06/08/2006
 
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