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Inventor: Heico J. Frima


Address: Hong Kong, HK
No. of patents: 1
Last patent issue date: 08/19/1986

NumberTitleIssue Date
4606490Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer
Apparatus and method for determining if a lead bond created by an ultrasonic transducer has the characteristics of a good bond. The current supplied to the transducer is monitored and the envelope of the supplied current is sampled periodically and suppli...
08/19/1986
 
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