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Inventor: Akishi Nakaso


Address: Tochigi, JP
No. of applications: 1
Last application issue date: 04/24/2008

Application No.Application TitleIssue Date
20080096046Method Of Treating The Surface Of Copper And Copper
A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copp...
04/24/2008
 
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