Bizarre Patents
Cloaking System Using Optoelectronically Controlled Camouflage
A Cloaking System designed to operate in the visible light spectrum, utilizes optoelectronics and/or photonic components to conceal an object within it.
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| Number | Title | Issue Date |
| 8294253 | Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure A semiconductor device includes: an electronic component including an electrode pad forming face on which electrode pads are formed, a back face opposite to the electrode pad forming face; a sealing resin including a first face provided on the electrode pad forming ... | 10/23/2012 |
| 8179692 | Board having connection terminal A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end ... | 05/15/2012 |
| 8152535 | Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting board A socket includes a first relay board provided above a mounting board; a second relay board detachably provided above the first relay board; and a frame part provided at side parts of the first relay board and the second relay board, wherein the frame part is config... | 04/10/2012 |
| 8083529 | Socket A socket includes a first relay board mounted on a mounting board, a second relay board detachably mounted on the first relay board, and a frame part fixed to the first relay board. The frame part positions and holds the first and second relay boards, and positions ... | 12/27/2011 |
| 7972149 | Board with connection terminals Connection terminals each include: a bonding portion bonded to a pad of a substrate; a contacting portion disposed to face the bonding portion; a spring portion present between the bonding portion and the contacting portion; and an engaging portion engaged with a po... | 07/05/2011 |
| 7220657 | Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The semiconductor wafer can be preferably used for producing a chip-sized s... | 05/22/2007 |
| 6667235 | Semiconductor device and manufacturing method therefor An undercut portion is provided in the side surface of a wiring pattern formed over the electrode terminal forming surface of a semiconductor element so that when the top of the electrode terminal forming surface of the semiconductor element is sealed, a ... | 12/23/2003 |
| 6413404 | Method of forming bumps by electroplating Bumps are formed by means of uniform plating in which air can be easily discharged. A plating device comprises: a plating tank 32; a holding jig 34 detachably attached to an object 35 to be plated, the holding jig 34 being connected with a cathode and ele... | 07/02/2002 |
| 6184567 | Film capacitor and semiconductor package or device carrying same A thin film capacitor comprises a substrate having first and second surfaces, a first electrode film formed on the first surface of the substrate, a high-dielectric film formed on the first electrode film, a second electrode film formed on said high-diele... | 02/06/2001 |
| 6030512 | Device for forming bumps by metal plating Bumps are formed by means of uniform plating in which air can be easily discharged. A plating device comprises: a plating tank 32; a holding jig 34 detachably attached to an object 35 to be plated, the holding jig 34 being connected with a cathode and ele... | 02/29/2000 |
