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...During the Civil War, the Confederacy established its own Patent Office which issued 266 patents, a third of which concerned implements of war.
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| Number | Title | Issue Date |
| 7781973 | Plasma display panel having laminated members and visible light reflection layer A plasma display panel has plural discharge cells between two opposing first and second substrates. Each of the discharge cells includes at least one pair of electrodes for generating a discharge for display, a discharge gas and a phosphor film for emitting visible ... | 08/24/2010 |
| 7183711 | Plasma display panel and video display system employing same A plasma display panel includes plural discharge cells and a barrier rib layer which defines the discharge cells. Each discharge cells has two opposing electrodes on front and rear substrates, respectively, for generating discharge therebetween, discharge gas and ph... | 02/27/2007 |
| 6815073 | Electronic component and method of manufacturing the same The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste ... | 11/09/2004 |
| 6451187 | Air/fuel ratio sensor A detector for an air/fuel ratio sensor, which is comprised of a structure formed by stacking an oxygen reference electrode, a dense zirconia solid electrolyte, a negative electrode, a porous zirconia solid electrolyte, a positive electrode and a porous p... | 09/17/2002 |
| 6118671 | Circuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computer Ceramic circuit substrate which is sintered at 900 to 1,050° C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass... | 09/12/2000 |
| 5925444 | Organic binder for shaping ceramic, its production method and product employing the same A multilayer ceramic substrate comprising at least one ceramic layer made by laminating at least one ceramic green sheet layer and conductor layers formed on surfaces of the at least one ceramic green sheet layer into laminates and by sintering the result... | 07/20/1999 |
| 5825632 | Circuit substrate and electronics computer, using sintered glass ceramics Ceramic circuit substrate which is sintered at 900° to 1,050° C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a gla... | 10/20/1998 |
| 5473194 | Chip carrier having through hole conductors A chip carrier has an electrically insulating substrate with through holes and a multilayer structure formed on the substrate. The multilayer structure includes an electrical conductor pattern for electrical connection with through hole conductors provide... | 12/05/1995 |
| 5396034 | Thin film ceramic multilayer wiring hybrid board A ceramic thin film hybrid circuit board is provided by flattening the surface of a ceramic multi-layer interconnection substrate, forming capture pads on the flattened surface, filling spaces between the capture pads with an insulating layer composed of ... | 03/07/1995 |
| 4952272 | Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming ... | 08/28/1990 |
| 4935285 | Ceramic substrates for microelectronic circuits and process for producing same A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite ... | 06/19/1990 |
| 4908696 | Connector and semiconductor device packages employing the same The present invention relates to a connector structure for soldering a wiring substrate such as a ceramic wiring substrate to a connector provided on a printed board and also pertains to semiconductor device packages using the same. It is an object of the... | 03/13/1990 |
| 4817276 | Process for producing ceramic substrates for microelectronic circuits A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite ... | 04/04/1989 |
| 4734233 | Ceramic wiring substrate and process for producing the same A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) h... | 03/29/1988 |
| 4713494 | Multilayer ceramic circuit board A multilayer ceramic circuit board and method of forming such circuit board are disclosed. The wiring pattern for the multilayer ceramic circuit board includes multiple-layer portions, the multiple-layer portions including first and second electrically co... | 12/15/1987 |
| 4608316 | Ceramic wiring board and process for producing the same A ceramic wiring board comprising a silica board having pores of several ten to several hundred Å in diameter amounting to 5 to 20 vol % of the insulating layer, and a process for producing the same, which comprises heat-treating a silicon alkoxide to fo... | 08/26/1986 |
| 4576735 | Electroconductive molybdenum paste An electroconductive molybdenum paste comprising 100 parts by weight of a mixture consisting of 68.0 to 89.2% by weight of molybdenum powders having an average particle size of 0.5 to 10 μm, 10.0 to 27.0% by weight of a solvent, and 0.8 to 5.0% by weight... | 03/18/1986 |
| 4465727 | Ceramic wiring boards A ceramic wiring board which comprises ceramic part in which through-holes are made, sintered wiring pattern part provided on the surface of said ceramic part and sintered conductor part filled in said through-holes shows much decrease in cracks at the th... | 08/14/1984 |
| 4457950 | Process for producing wiring circuit board A wiring circuit board with a fine wiring pattern free from disconnection and poor insulation is produced by forming an insulating layer consisting of at least two insulating substances having different dissociation energies for metalization, including me... | 07/03/1984 |
| 4336551 | Thick-film printed circuit board and method for producing the same A thick-film printed circuit board and a method for producing the same are disclosed, in which wiring conductors having connecting sections for connection with solder electrodes of an electronic element such as a semiconductor chip are provided on an insu... | 06/22/1982 |
