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| Number | Title | Issue Date |
| 7449771 | Multiple leadframe laminated IC package A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a se... | 11/11/2008 |
| 7410830 | Leadless plastic chip carrier and method of fabricating same A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that... | 08/12/2008 |
| 6734044 | Multiple leadframe laminated IC package A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a se... | 05/11/2004 |
| 6585905 | Leadless plastic chip carrier with partial etch die attach pad A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad. The row of contact pads have a thickness greater than the t... | 07/01/2003 |
