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Inventor: Tomoyuki Kugo


Address: Shizuoka, JP
No. of patents: 1
Last patent issue date: 06/06/2006

NumberTitleIssue Date
7056552Heat-sensitive adhesive material
A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticiz...
06/06/2006
 
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