Inventor: Timothy Antesberger

Address: Binghamton, NY
No. of patents: 3
Last patent issue date: 01/16/2007

Number	Title	Issue Date
7163847	Method of making circuitized substrate A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric laye...	01/16/2007
7091066	Method of making circuitized substrate A method of making a circuitized substrate in which a commoning bar, used during the plating of the circuitry on the substrate and coupled to a second set of conductors which in turn are coupled to a first set of conductors, is terminated from the second set of cond...	08/15/2006
7084014	Method of making circuitized substrate A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric laye...	08/01/2006

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