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| Number | Title | Issue Date |
| 6921017 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further com... | 07/26/2005 |
| 6817823 | Method, device and system for semiconductor wafer transfer The invention relates to a wafer transfer system that achieves high efficiency, as measured by throughput rate. This is accomplished in one instance by the combination of reliable transfer of single wafers between ports while being simultaneously rotated to accompli... | 11/16/2004 |
| 6709967 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam are herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses to the co... | 03/23/2004 |
| 6634538 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 10/21/2003 |
| 6588649 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 07/08/2003 |
| 6390853 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam are herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuse... | 05/21/2002 |
| 6375061 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 04/23/2002 |
| 6352191 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 03/05/2002 |
| 6211053 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 04/03/2001 |
| 6159609 | Method and apparatus for applying atomized adhesive to a leadframe for chip bonding An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe are disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device... | 12/12/2000 |
| 6138891 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 10/31/2000 |
| 6129039 | Apparatus for applying atomized adhesive to a leadframe for chip bonding An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device c... | 10/10/2000 |
| 6126062 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 10/03/2000 |
| 6105846 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 08/22/2000 |
| 6030711 | Method and apparatus for applying atomized adhesive to a leadframe for chip bonding An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe are disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device... | 02/29/2000 |
| 6001725 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 12/14/1999 |
| 5996805 | Lead frame casing A lead frame casing for housing a stack of lead frame strips. The casing includes a central volume-defined between substantially rigid members and resilient members. The former define at least one reference plane and the latter are deflected toward the fo... | 12/07/1999 |
| 5962862 | Method and apparatus for verifying the presence or absence of a component Apparatuses and methods are disclosed for verifying the presence or absence of a die in a location, dice in a cut wafer or other components in a pattern. The apparatuses includes a wafer support, a radiation source, a radiation detector and a controller. ... | 10/05/1999 |
| 5956607 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 09/21/1999 |
| 5874322 | Method and apparatus for applying atomized adhesive to a leadframe for chip bonding An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device ... | 02/23/1999 |
| 5872405 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 02/16/1999 |
| 5836454 | Lead frame casing A lead frame casing for housing a stack of lead frame strips. The casing includes a central volume defined between substantially reference members and resilient members. The substantially rigid member define at least one reference plane and the resilient ... | 11/17/1998 |
| 5810926 | Method and apparatus for applying atomized adhesive to a leadframe for chip bonding An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device ... | 09/22/1998 |
| 5731244 | Laser wire bonding for wire embedded dielectrics to integrated circuits A method and apparatus for connecting a lead of a lead frame to a contact pad of a semiconductor chip using a laser or other energy beam is herein disclosed. The lead may be wire bonded to the contact pad by heating the ends of a wire until the wire fuses... | 03/24/1998 |
