Inventor: Susumu Kasukabe

Address: Yokohama, JP
No. of patents: 24
Last patent issue date: 11/20/2012

Number	Title	Issue Date
8314624	Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-...	11/20/2012
7956627	Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-...	06/07/2011
7724006	Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device A silicon substrate is used as a mold, and thin films such as metal films and polyimide films are sequentially stacked on the silicon substrate by using photolithography techniques, thereby forming a probe sheet having contact terminals having a pyramidal shape or a...	05/25/2010
7656174	Probe cassette, semiconductor inspection apparatus and manufacturing method of semiconductor device A manufacturing method of a semiconductor device employing a semiconductor inspection apparatus to accurately inspect semiconductor elements while still in the wafer state, the semiconductor inspection apparatus including: a probe sheet 31 having contact term...	02/02/2010
7541202	Connection device and test system To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film ...	06/02/2009
7423439	Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electro...	09/09/2008
7420380	Probe card and semiconductor testing device using probe sheet or probe card semiconductor device producing method A probe card, and a probe sheet used for the method of testing (producing) a semiconductor device using the probe card, include first contact terminals in electrical contact with the electrodes of a test object formed at a narrow pitch, wires connected with and led ...	09/02/2008
7390732	Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and a method of fabrication thereof, characterized in that pyramidal bump...	06/24/2008
7351597	Fabrication method of semiconductor integrated circuit device The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coeff...	04/01/2008
7285430	Connection device and test system To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film ...	10/23/2007
7227370	Semiconductor inspection apparatus and manufacturing method of semiconductor device When electrical properties of semiconductor chips of a semiconductor wafer are inspected by bringing plural contact terminals disposed on the principal surface of a probe sheet of a probe cassette constituting a semiconductor inspection apparatus into contact with p...	06/05/2007
7219422	Fabrication method of semiconductor integrated circuit device The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coeff...	05/22/2007
7198962	Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on th...	04/03/2007
7049837	Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals electrically connected to the wirings, wherein the first contact terminals are...	05/23/2006
6900646	Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof A probing device for electrically contacting with a plurality of electrodes 3, 6 aligned on an object 1 to be tested so as to transfer electrical signal therewith, comprising: a wiring sheet being formed by aligning a plurality of contact electrodes	05/31/2005
6759258	Connection device and test system To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film ...	07/06/2004
6617863	Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof A probing device for electrically contacting a plurality of electrodes aligned on an object to be tested so as to transfer electrical signal therewith. The probing device includes a wiring sheet formed by aligning a plurality of contact electrodes, corres...	09/09/2003
6566150	Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure me...	05/20/2003
6455335	Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure me...	09/24/2002
6305230	Connector and probing system A connection device and test system is capable of stable, low load damage-free probing of devices under test, which have many pins with a narrow pitch. Furthermore in order to achieve high speed exchange of electrical signals or so-called high frequency e...	10/23/2001
6197603	Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a ...	03/06/2001
5191708	Manufacturing method of a probe head for semiconductor LSI inspection apparatus The present invention relates to a manufacturing method of a probe head for an inspection apparatus of a semiconductor device represented by an LSI, and more particularly to a manufacturing method suitable for forming probes with high accuracy in forming ...	03/09/1993
4952272	Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming ...	08/28/1990
4931726	Apparatus for testing semiconductor device A semiconductor device testing apparatus which has a plurality of probes and plurality of coaxial cables connected therewith for impedance matching and a plurality of springs for providing flexibility to the individual probes to absorb a level difference ...	06/05/1990

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Inventor: Susumu Kasukabe