Did You Know...
...that in the early 1940s GE engineer James Wright was charged with a task of utmost importance to the war effort: develop a cheap substitute for rubber that could be used to produce tires, gas masks and a whole host of military gear. Wright tackled the task diligently -- and wound up inventing Silly Putty.
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| Number | Title | Issue Date |
| 7319197 | Structure of stacked vias in multiple layer electrode device carriers A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, | 01/15/2008 |
| 6967398 | Module power distribution network A multi-layer module for packaging an electronic component comprises an uppermost electrically conductive layer for mounting the component, a plurality of electrically insulative layers, and a plurality of electrically conductive layers disposed between the insulati... | 11/22/2005 |
| 6806122 | Ball grid array module A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. The present invention allows to reduce the overall thickness of the package, by tailoring the different mechanical portions of the module structure (interconnection balls... | 10/19/2004 |
| 6717255 | Chip carrier for a high-frequency electronic package An electronic package is provided. The electronic package includes a chip carrier having a first conductive layer which includes at least one signal track and at least one contact area, the contact area being electrically connected to the signal track and adapted fo... | 04/06/2004 |
| 6710258 | Circuitized substrate for high-frequency applications A multi-layered circuitized substrate for high-frequency applications. Conductive via-holes extend between two non-adjacent conductive layers for transmitting high-frequency signals therebetween. For each via-hole, shielding rings connectable to a reference voltage ... | 03/23/2004 |
| 6639304 | Ball grid array module A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. The present invention allows to reduce the overall thickness of the package, by tailoring the different mechanical portions of the module structure (interconne... | 10/28/2003 |
| 6398081 | Volumetric pump A volumetric pump for dispensing a controlled and continuous flow of viscous fluid. The pump according to a preferred embodiment of the present invention can ideally dispense from a minimum of 1 mg/sec to 1 g/sec for fluids with a viscosity from 2,000,000... | 06/04/2002 |
