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Inventor: Ryouta Bandou


Address: Yokohama, JP
No. of patents: 1
Last patent issue date: 04/24/2001

NumberTitleIssue Date
6221162Apparatus for forming a resist layer over an electroconductive substrate
An apparatus for supplying a liquid resist into a through hole part of an electroconductive substrate comprises an application roll, rotating in a single rotational direction, for coating the electroconductive substrate carried by a carrier with a liquid ...
04/24/2001
 
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