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| Number | Title | Issue Date |
| 7899239 | Inspection method of bonded status of ball in wire bonding An inspection method of determining the bonded status of a wire ball bonded to a pad of a semiconductor chip is provided. An image of the bonding position between the pad and the ball is taken by an image-taking unit for detection of an in focus height of the pad, i... | 03/01/2011 |
| 7191929 | Method of measuring thickness of bonded ball in wire bonding A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtainin... | 03/20/2007 |
