|7899239||Inspection method of bonded status of ball in wire bonding|
An inspection method of determining the bonded status of a wire ball bonded to a pad of a semiconductor chip is provided. An image of the bonding position between the pad and the ball is taken by an image-taking unit for detection of an in focus height of the pad, i...
|7191929||Method of measuring thickness of bonded ball in wire bonding|
A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtainin...