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| Number | Title | Issue Date |
| 8349106 | Adhesive tape joining method and adhesive tape joining apparatus A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mech... | 01/08/2013 |
| 8258490 | Ultraviolet irradiation device Prior to applying of ultraviolet rays to a surface of a wafer with a protective tape joined thereto that is placed and held on a holding table, an illumination sensor moves to a position below an ultraviolet irradiation unit having ultraviolet light emitting diodes ... | 09/04/2012 |
| 8127647 | Protective tape cutting method for semiconductor wafer and device of the same A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively mo... | 03/06/2012 |
| 8109185 | Method for cutting protective tape of semiconductor wafer and protective tape cutting device A cutter blade is cut-in by being moved towards a deep part of a notch from one open end of the notch while being moved in a forward direction with respect to an outer periphery of a wafer. Immediately before a blade edge reaches the deep part of the notch, cutting ... | 02/07/2012 |
| 8097121 | Protective tape separation method and protective tape separation apparatus A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tap... | 01/17/2012 |
| 8062474 | Protective tape separation method and apparatus using the same A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member t... | 11/22/2011 |
| 8042441 | Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape A cutter blade movably in a radial direction of a wafer is pressed for biasing to an outer circumferential edge of the semiconductor wafer. Simultaneously, the pushing biasing force of the cutter blade is controlled constant with automatic regulation corresponding t... | 10/25/2011 |
| 8038816 | Method and apparatus for separating protective tape from semiconductor wafer A method of this invention involves capturing an image of an outer periphery of a semiconductor wafer, by use of a CCD camera, performing image analysis on data about the captured image, detecting defects such as chips and cracks on the outer periphery of the semico... | 10/18/2011 |
| 7987886 | Protective tape joining apparatus A chuck table is configured with a table main body having a wafer placement part holding a wafer placed thereon, and an annular tape support frame provided outside the wafer placement part with a cutter blade traveling groove being interposed therebetween. The tape ... | 08/02/2011 |
| 7922857 | Label joining method and label joining apparatus A receiver base receives from below a front end portion of a label that is fed forward from a folded-back portion of an release paper and droops forward, so that the label is held in a predetermined forwardly and downwardly inclined posture. In a process of separati... | 04/12/2011 |
| 7913735 | Adhesive tape joining apparatus An adhesive tape joining apparatus of this invention adopts an inverted âTâ-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. A... | 03/29/2011 |
| 7896050 | Apparatus for cutting the protective tape of semiconductor wafer An outer edge of a protective tape projected from a semiconductor wafer is fixed and held by a tape holding section. In the condition, a part of the projected protective tape is caught and supported with a tape supporting section with a face having lower adhesive pr... | 03/01/2011 |
| 7876432 | Method for detecting position of defect on semiconductor wafer A method of this invention involves: detecting a shape of an outer periphery of a semiconductor wafer with a first detecting device; determining a center position of the semiconductor wafer based on a detected result by the first detecting device; receiving a light ... | 01/25/2011 |
| 7875145 | Method and apparatus for joining adhesive tape An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tap... | 01/25/2011 |
| 7849899 | Adhesive film position detector and adhesive film joining apparatus An illuminator emits light obliquely to an end of an adhesive film. A CCD camera is provided in a direction perpendicular to the adhesive film to capture an image of the light reflected irregularly from the end of the adhesive film. A black plate is provided on a ba... | 12/14/2010 |
| 7811899 | Method for laminating substrate and apparatus using the method A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece... | 10/12/2010 |
| 7807004 | Method for joining adhesive tape This invention is directed to a method for joining an adhesive tape having the steps (1) separating, from a first adhesion face of a double-sided adhesive tape having first and second separators attached to front and back adhesion faces thereof, the first separator,... | 10/05/2010 |
| 7723211 | Method for joining adhesive tape to semiconductor wafer and method for separating protective tape from semiconductor wafer An arithmetic processing part in a controller detects a position of a defect such as a chip or a crack that occurs at an outer periphery of a semiconductor wafer, and then a memory in the controller stores position information of the defect. The controller reads the... | 05/25/2010 |
| 7661454 | Adhesive tape joining apparatus An apparatus of this invention includes: a workpiece holding mechanism that holds a ring frame and a wafer; a tape supplying device that supplies a continuous dicing tape or a continuous carrier tape to which a precut dicing tape is joined, to a joining position; a ... | 02/16/2010 |
| 7598120 | Method for holding semiconductor wafer Provided is a method comprising: back grinding a back side or a semiconductor wafer W having a protective tape applied on the surface thereof leaving annularly an outer peripheral part un-ground; separating the protective tape from a surface of the semiconductor waf... | 10/06/2009 |
| 7521122 | Laminated sheet A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, ... | 04/21/2009 |
| 7504316 | Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer A reinforcing-plate fixed to a reinforced semiconductor wafer is separated from the wafer which includes a semiconductor wafer, a double-side adhesive sheet having, on at least one surface thereof, a peelable adhesive layer stuck to a front face of the semiconductor... | 03/17/2009 |
| 7429522 | Dicing die-bonding film A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is po... | 09/30/2008 |
| 7309925 | Dicing die-bonding film A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is po... | 12/18/2007 |
| 6803293 | Method of processing a semiconductor wafer The present invention is to provide a method of processing a semiconductor wafer, comprising the steps of: sticking a support wafer onto a front surface of a semiconductor wafer having a pattern formed thereon, with a two-sided adhesive sheet; and performing a thinn... | 10/12/2004 |
| 6235144 | Resist removing apparatus and method A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. T... | 05/22/2001 |
| 6099675 | Resist removing method An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist patt... | 08/08/2000 |
| 5759336 | Resist removing apparatus A resist removing apparatus for removing unnecessary resist patterns from articles such as semiconductor substrates efficiently by using adhesive tape. A tape applicator unit is movable horizontally to apply the adhesive tape in strip form to a wafer supp... | 06/02/1998 |
