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Inventor: Masatoshi Anma


Address: Hyogo, JP
No. of patents: 3
Last patent issue date: 07/29/2003

NumberTitleIssue Date
6599809Method of manufacturing semiconductor device having a marking recess
A semiconductor device capable of preventing yield reduction and a method of manufacturing the same can be obtained. The method of manufacturing a semiconductor device including an element formation region arranged on a semiconductor substrate and an exte...
07/29/2003
6319812Method of manufacturing a semiconductor device
Sintering is effected a gate insulating film of a transistor in a hydrogen atmosphere at a temperature from 450° C. to 600° C. only before formation of an interconnection layer such as an aluminum interconnection layer which is less resistant to heat tr...
11/20/2001
5729035Non-volatile semiconductor device with multi-layered capacitor insulating film
A structure and a manufacturing method of a semiconductor device which prevents leakage of electric charges from a floating gate electrode to outside. The semiconductor device includes a capacitor insulating film at an upper surface and opposing sidewall ...
03/17/1998
 
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