U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Icon_funbox Quotables

"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "

Mark Twain ; Christmas greetings, 1890

Newsletter  PatentStorm News

Make the Most of Our Site

See this month's Top Inventors and Most Cited Patents.

Stay on top of the latest innovations by subscribing to an RSS feed.

Registered users: Manage your profile.

 

Inventor: Kenji Tsukamoto


Address: Tokyo, JP
No. of patents: 3
Last patent issue date: 01/06/1998

NumberTitleIssue Date
5705858Packaging structure for a hermetically sealed flip chip semiconductor device
A packaging structure for a semiconductor device has plural hermetically sealed units each containing a flip-chip electrically interconnected to an intermediate substrate, circuit patterns of the flip-chips being within the sealed environment. Each hermet...
01/06/1998
5640052Interconnection structure of electronic parts
An interconnection structure is provided which is simple in structure and is easily manufactured and in which stress generated in solder bumps is minimized. Pads of a semiconductor chip and pads of a substrate are connected to each other by solder bumps. ...
06/17/1997
5386625Tab type IC assembling method and an IC assembled thereby
A method of assembling an integrated circuit (IC) by a TAB (Tape Automated Bonding) system, and an IC assembled thereby. Leads extending from a TAB tape and connected to an IC are each partly reduced in width. Hence, even when the end portions of the lead...
02/07/1995
 
Sign InRegister
Username  
Password   
forgot password?