Inventor: Kazutaka Shibata

Address: Kyoto, JP
No. of patents: 70
Last patent issue date: 09/27/2011

Number	Title	Issue Date
8026591	Semiconductor device with lead terminals having portions thereof extending obliquely A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconduct...	09/27/2011
7705444	Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross section A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconduct...	04/27/2010
7687896	Semiconductor device having a stacked chip structure A semiconductor device formed by mutually connecting a first semiconductor chip with second and third semiconductor chips arranged side by side, with the active surface of the first chip faced to those of the second and third chip. Both the second and third semicond...	03/30/2010
7589415	Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip A semiconductor chip in which a through hole penetrating through its surface and reverse surface is formed in a scribe line region in the vicinity of an active region where a functional device is formed, and a conductive member is arranged in the through portion. Th...	09/15/2009
7384863	Semiconductor device and method for manufacturing the same In a disclosed COC type semiconductor device, a bump electrode (21) of a second semiconductor chip (2) is joined to a first semiconductor chip (1) having a bump electrode (11) formed thereon. The bump electrodes (11) and (21...	06/10/2008
7358618	Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s...	04/15/2008
7345368	Semiconductor device and the manufacturing method for the same A semiconductor device has a semiconductor substrate having first and second surface, a first resin film formed on the first surface of the semiconductor substrate and a second resin film formed on the second surface of the semiconductor substrate. A projection elec...	03/18/2008
7339264	Semiconductor chip with external connecting terminal A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring b...	03/04/2008
7329603	Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s...	02/12/2008
7285446	Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device The present invention provides a mounting structure of a semiconductor chip (3) onto an insulated substrate (2). The insulated substrate (2) is made of a polyimide resin, at least side surfaces (3c) of the semiconductor chip (3	10/23/2007
7262490	Semiconductor chip with external connecting terminal A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring b...	08/28/2007
7247518	Semiconductor device and method for manufacturing same There is provided a semiconductor device of a chip-on-chip structure having a support semiconductor chip, first and second chip blocks supported and connected on one surface of the support semiconductor chip and an insulator arranged between the first and second chi...	07/24/2007
7192870	Semiconductor device and fabrication process therefor A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the...	03/20/2007
7180194	Semiconductor device with multi-staged cut side surfaces A method for manufacturing a semiconductor device which enables favorable back-surface grinding of a semiconductor substrate with preventing a warp in the substrate, thereby manufacturing a thickness-reduced semiconductor device. A projection electrode is formed on ...	02/20/2007
7138298	Semiconductor chip with external connecting terminal A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring b...	11/21/2006
7129110	Semiconductor device and method for manufacturing the same A method for manufacturing a semiconductor device having projection electrodes on the surface of a semiconductor substrate. This method include an electrode forming step of forming the projection electrodes on the surface of the semiconductor substrate, a step of fo...	10/31/2006
7091591	Semiconductor device A semiconductor device formed by mutually connecting a first semiconductor chip with second and third semiconductor chips arranged side by side, with the active surface of the first chip faced to those of the second and third chip. Both the second and third semicond...	08/15/2006
7057294	Semiconductor device Circuit elements are formed in a semiconductor chip (1) and an electrode pad (11) for connection with outside is formed on the periphery of a surface of the semiconductor chip (1). On the other hand, a wiring (21) is formed on one surface...	06/06/2006
7045900	Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device A semiconductor chip having a functional bump provided on a surface of a semiconductor substrate thereof for electrical connection between an internal circuit thereof and a solid device, and a dummy bump not serving for the electrical connection between the internal...	05/16/2006
7009294	Production process for semiconductor device A production process for a semiconductor device having a metal electrode on a semiconductor substrate thereof. A metal electrode portion is formed on a surface of another substrate for electrode transfer. Then, the metal electrode portion is transferred from the ele...	03/07/2006
6967396	Semiconductor device A semiconductor device in which a lead frame having inner connecting portions and outer connecting portions, a semiconductor chip having electrodes on the surface thereof, and metal wires for electrically connecting electrodes on the semiconductor chip and the inner...	11/22/2005
6936499	Semiconductor device and fabrication process therefor A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the...	08/30/2005
6870248	Semiconductor chip with external connecting terminal A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring b...	03/22/2005
6867501	Semiconductor device and method for manufacturing same There is provided a semiconductor device of a chip-on-chip structure having a support semiconductor chip, first and second chip blocks supported and connected on one surface of the support semiconductor chip and an insulator arranged between the first and second chi...	03/15/2005
6835593	Method for manufacturing semiconductor device A method for manufacturing a semiconductor device by bonding a first metal bump formed on a first semiconductor substrate and a second metal bump formed on a second semiconductor substrate together. This method includes a low melting point metal layer forming step f...	12/28/2004
6818550	Method of cutting a wafer into individual chips A method for manufacturing a semiconductor device which enables favorable back-surface grinding of a semiconductor substrate with preventing a warp in the substrate, thereby manufacturing a thickness-reduced semiconductor device. A projection electrode is formed on ...	11/16/2004
6815832	Semiconductor device having opposed and connected semiconductor chips with lateral deviation confirming electrodes A semiconductor device having first and second semiconductor chips opposed and connected, at respective active surfaces, to each other. The first semiconductor chip has a first internal connection electrode and a first lateral-deviation confirming electrode. The sec...	11/09/2004
6815829	Semiconductor device with compact package In a semiconductor device having a structure in which a semiconductor chip is bonded to a surface of a solid device (a semiconductor chip, a wiring substrate or the like), the semiconductor device is thinned. A primary chip 31 and a secondary chip 32 a...	11/09/2004
6782615	Method of surface-mounting electronic components A plurality of electronic components having conductive connecting members are surface-mounted to a target surface of a circuit board by specifying terminal-forming areas that are each no greater than the corresponding one of the electronic components and each includ...	08/31/2004
6781247	Semiconductor device This is a COC type semiconductor device in which a second bump of a second semiconductor chip is bonded on a first bump provided on a first semiconductor chip. The bumps of the first and second semiconductor chips are made of a first metal having relatively high mel...	08/24/2004
6777787	Semiconductor device with warp preventing board joined thereto A semiconductor device having a semiconductor chip, a wiring board joined to one surface of the semiconductor chip and electrically connected to the semiconductor chip, and a warp preventing board joined to the other surface of the semiconductor chip and composed of...	08/17/2004
6734556	Semiconductor device with chip-on-chip construction joined via a low-melting point metal layer In a COC type semiconductor device, a bump electrode of a second semiconductor chip is joined to a first semiconductor chip having a bump electrode formed thereon. The bump electrodes and of the respective first and second semiconductor chips and are both made of fi...	05/11/2004
6727582	Semiconductor device A semiconductor device formed by mutually connecting a first semiconductor chip with second and third semiconductor chips arranged side by side, with the active surface of the first chip faced to those of the second and third chip. Both the second and third semicond...	04/27/2004
6724084	Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device A semiconductor chip having a functional bump provided on a surface of a semiconductor substrate thereof for electrical connection between an internal circuit thereof and a solid device, and a dummy bump not serving for the electrical connection between the internal...	04/20/2004
6717274	Semiconductor device having a warp preventing sheet A semiconductor device provided with a semiconductor chip having one surface bonded to a substrate, and the other surface bonded to a warp preventing sheet. Preferably, the warp preventing sheet has a coefficient of elasticity substantially equal to that of the subs...	04/06/2004
6710431	Semiconductor device and lead frame used therefor A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconduct...	03/23/2004
6700189	Resin sealed semiconductor device A semiconductor device in which a lead frame having inner connecting portions and outer connecting portions, a semiconductor chip having electrodes on the surface thereof, and metal wires for electrically connecting electrodes on the semiconductor chip an...	03/02/2004
6696347	Production process for semiconductor device A production process for a semiconductor device having a metal electrode on a semiconductor substrate thereof. A metal electrode portion is formed on a surface of another substrate for electrode transfer. Then, the metal electrode portion is transferred f...	02/24/2004
6635962	Chip on chip semiconductor device In the case where a plurality of second semiconductor chips (2a and 2b) are bonded to the surface side of a first semiconductor chip (1) via bump electrodes (11 and 21), an interconnection (9) for directly connecting electrode terminals (22a and 22b) of t...	10/21/2003
6627981	Resin-packaged semiconductor device A plurality of leads are arrayed around an island (1) to which a semiconductor chip (3) is bonded. A plurality of first wires (4) interconnects each electrode terminal of the semiconductor chip (3) and each of the plurality of leads (2), while a second wi...	09/30/2003

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Inventor: Kazutaka Shibata