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...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.

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Inventor: Howard R. Beratan


Address: Richardson, TX
No. of patents: 55
Last patent issue date: 10/12/2004

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NumberTitleIssue Date
6802987Integrated circuit ferroelectric infrared detector and method
Ferroelectric materials useful in monolithic uncooled infrared imaging use Ca and Sn substitutions in PbTiO3 and also have alternatives with dopants such as Dy, Ho, Bi, Ce, and Fe. The ferroelectrics may also be used in non-volatile integrated circuit memories. ...
10/12/2004
6777681Infrared detector with amorphous silicon detector elements, and a method of making it
An infrared detector (10) includes a substrate (16) having thereon an array of detector elements (21, 139). Each detector element has a membrane (41, 81, 91, 111, 141), which includes an amorphous silicon layer (51, 142) in contact...
08/17/2004
6593638Lightly donor doped electrodes for high-dielectric-constant materials
A preferred embodiment of this invention comprises a conductive lightly donor doped perovskite layer (e.g. lightly La doped BST 34), and a high-dielectric-constant material layer (e.g. undoped BST 36) overlaying the conductive lightly donor doped perovski...
07/15/2003
6432473PB substituted perovskites for thin films dielectrics
The invention described is a method of forming an improved dielectric material by adding lead to an original perovskite material having an original critical grain size to form a lead enhanced perovskite material, then forming a layer of the lead enhanced ...
08/13/2002
6361825Micro-bolometer cell structure
A pyroelectric detector system, the pyroelectric detector element therefor and the method of making the detector element which comprises an integrated circuit (1) and a pyroelectric detector element (7) coupled to the integrated circuit and thermally isol...
03/26/2002
6319542Lightly donor doped electrodes for high-dielectric-constant materials
A preferred embodiment of this invention comprises a conductive lightly donor doped perovskite layer (e.g. lightly La doped BST 34), and a high-dielectric-constant material layer (e.g. undoped BST 36) overlaying the conductive lightly donor doped perovski...
11/20/2001
6280662Methods of fabrication of ceramic wafers
Ceramic powder (50) may be disposed within a flexible mold (30 and 130) to form a dense ceramic wafer (60) by hydrostatic pressing. The ceramic powder (50) may include various types of pyroelectric material or bolometric material. One or more substrates (...
08/28/2001
6270688Chemical polishing of barium strontium titanate
A method of polishing ferroelectric materials and specifically perovskite materials and still more specifically barium strontium titanate (1) wherein the surface (5) to be polished is initially partially smoothened or planarized by mechanical abrading wit...
08/07/2001
6245591High MTF optical coating for hybrid UFPA's
An optical coating for an uncooled focal plane array detector where the optical coating comprises a porous film. The porous film preferably comprises a xerogel....
06/12/2001
6204069Lightly donor doped electrodes for high-dielectric-constant materials
A preferred embodiment of this invention comprises a conductive lightly donor doped perovskite layer (e.g. lightly La doped BST 34), and a high-dielectric-constant material layer (e.g. undoped BST 36) overlaying the conductive lightly donor doped perovski...
03/20/2001
6177351Method and structure for etching a thin film perovskite layer
A method and structure for etching a thin film perovskite layer (e.g., barium strontium titanate 836) overlying a second material without substantially etching the second material. The method comprises forming a substantially-silicon-free dielectric etchs...
01/23/2001
6137107Thermal detector with inter-digitated thin film electrodes and method
Thermal sensor (36) may include a thermally sensitive element (50), a first thin film electrode (52) and a second thin film electrode (54). The thermally sensitive element (50) may include a plurality of preferentially-ordered crystals. The first thin fil...
10/24/2000
6087661Thermal isolation of monolithic thermal detector
A thermal sensor (36, 84, 114) comprising a thermal assembly (44, 88, 118) and a signal flowpath (46, 90, 120). The thermal assembly (44, 88, 118) may comprise a thermally sensitive element (50) and a pair of electrodes (52, 54). The thermally sensitive e...
07/11/2000
6020216Thermal detector with stress-aligned thermally sensitive element and method
Method of stress-aligning a thermally sensitive element may comprise the step of forming a thin film layer of thermally sensitive material (80). The thin film layer of thermally sensitive material (80) may be crystallized. A stress alignment layer (82) ma...
02/01/2000
5990481Thermal detector with preferentially-ordered thermally sensitive element and method
Thermal sensor (36) mounted to a substrate (34). The thermal sensor (36) may include a thermally sensitive element (50), a first thin film electrode (52) and a second thin film electrode (54). The thermally sensitive element (50) may comprise a plurality ...
11/23/1999
5972108Method of preferentially-ordering a thermally sensitive element
Method of preferentially-ordering a thermally sensitive element (50) may comprise the step of forming a first thin film layer of electrically conductive material (75). A thin film layer of thermally sensitive material (80) may be formed on a surface of th...
10/26/1999
5945673Thermal detector with nucleation element and method
Thermal sensor (36) mounted to a substrate (34). The thermal sensor may include a first thin film electrode (52), a nucleation element (55), a thermally sensitive element (50) and a second thin film electrode (54). The first thin film electrode (52) may b...
08/31/1999
5929441Low mass optical coating for thin film detectors
A thermal detector having an optical coating comprising a porous film 64. The porous film preferably comprises a xerogel or aerogel and is greater than 80% porous. An optional optical impedance matching layer 66 may be deposited over the porous film 64. A...
07/27/1999
5888659Donor doped perovskites for thin-film ferroelectric and pyroelectric devices
The invention forms improved ferroelectric (or pyroelectric) material by doping an intrinsic perovskite material having an intrinsic ferroelectric (or pyroelectric) critical grain size with one or more donor dopants, then forming a layer of the donor dope...
03/30/1999
5834776Microbolometer cell structure
A pyroelectric detector system and the pyroelectric detector element therefor having an integrated circuit (1) and a pyroelectric detector element (7) coupled to the integrated circuit and thermally isolated from the integrated circuit. The element includ...
11/10/1998
5792377Method and structure for forming an array of thermal sensors
An array of thermal sensitive elements (16) may be formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of electrically conductive contacts (60) is formed to define in par...
08/11/1998
5746930Method and structure for forming an array of thermal sensors
An array of thermal sensitive elements (16) may be formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of electrically conductive contacts (60) is formed to define in par...
05/05/1998
5743006Method for fabricating a focal plane array for thermal imaging system
A hybrid thermal imaging system (20, 120) often includes a focal plane array (30, 130), a thermal isolation structure (50, 150) and an integrated circuit substrate (60, 160). The focal plane array (30, 130) includes thermal sensitive elements (42, 142) fo...
04/28/1998
5721043Method of forming improved thin film dielectrics by Pb doping
The invention described is an improved dielectric material formed as a film on the surface of a substrate by adding lead to an original perovskite material having an original critical grain size to form a lead enhanced perovskite material, then forming a ...
02/24/1998
5705041Method of minimizing surface effects in thin ferroelectrics
A method of improving the responsivity of a pyroelectric device including providing a pyroelectric element of less than maximum theoretical density having holes therein extending to a surface of the element and having contaminants at the surface (22), cle...
01/06/1998
5695384Chemical-mechanical polishing salt slurry
An improved slurry composition and method of polishing a workpiece are disclosed. This composition allows use of a neutral pH slurry for chemical-mechanical polishing many surfaces. One disclosed composition comprises 85% water, 4% NaCl, 4% H2 ...
12/09/1997
5656848High thermal resistance backfill material for hybrid UFPA's
A porous film 64 is used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous film 64 is preferably a silicon-dioxide xerogel. A protective film 65 may be deposited on the porous film...
08/12/1997
5654580Semiconductor structure for fabrication of a thermal sensor
An etching process is provided using electromagnetic radiation and a selected etchant (52) to selectively remove various types of materials (53) from a substrate (48). Contacts (49, 56, 64) may be formed to shield the masked regions (51) of the substrate ...
08/05/1997
5647946Structure and method including dry etching techniques for forming an array of thermal sensitive elements
An array of thermal sensor elements (16) is formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of metal contacts (60) is formed to define masked (61) and unmasked (68) r...
07/15/1997
5644838Method of fabricating a focal plane array for hybrid thermal imaging system
A hybrid thermal imaging system (20, 120) often includes a focal plane array (30, 130), a thermal isolation structure (50, 150) and an integrated circuit substrate (60, 160). The focal plane array (30, 130) includes thermal sensitive elements (42, 142) fo...
07/08/1997
5638599Method of fabricating hybrid uncooled infrared detectors
Thermal isolation mesas 36 comprising a porous material 64 are used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous material 64 is preferably a silicon-dioxide xerogel. The mesas...
06/17/1997
5626773Structure and method including dry etching techniques for forming an array of thermal sensitive elements
An array of thermal sensor elements (16) is formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of metal contacts (60) is formed to define masked (61) and unmasked (68) r...
05/06/1997
5627082High thermal resistance backfill material for hybrid UFPA's
A porous film 64 is used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous film 64 is preferably a silicon-dioxide xerogel. A protective film 65 may be deposited on the porous film...
05/06/1997
5619393High-dielectric-constant material electrodes comprising thin ruthenium dioxide layers
A preferred embodiment of this invention comprises a thin unreactive film (e.g. ruthenium dioxide 36) contacting a high-dielectric-constant material (e.g. barium strontium titanate 38) to an electrode. The thin unreactive film provides a stable conductive...
04/08/1997
5612574Semiconductor structures using high-dielectric-constant materials and an adhesion layer
A semiconductor device (10) is illustrated, which is formed on an active region (14) of a semiconductor substrate (12). Device (10) comprises a conductive plug (20) and a barrier layer (22) formed in an opening in an interlevel isolation layer (18). An in...
03/18/1997
5609927Processing methods for high-dielectric-constant materials
Processing techniques for processing high-dielectric-constant material are provided to allow for the formation of an electronic device (10) which comprises a inner electrode (24), a high-dielectric-constant layer (28), and an outer electrode (30). High-di...
03/11/1997
5604977Method of fabricating focal plane array
A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30)...
02/25/1997
5603848Method for etching through a substrate to an attached coating
An etching process is provided using electromagnetic radiation and a selected etchant (52) to selectively remove various types of materials (53) from a substrate (48). Contacts (49, 56, 64) may be formed to shield the masked regions (51) of the substrate ...
02/18/1997
5602043Monolithic thermal detector with pyroelectric film and method
One or more thin film layers of material may be formed on an integrated circuit substrate and anisotropically etched to produce a monolithic thermal detector. A first layer of material may be placed on the integrated circuit substrate and anisotropically ...
02/11/1997
5602392Thermal crosstalk reduction for infrared detectors with common electrodes
A hybrid thermal detector and method for producing same where the optical coating 32 of the hybrid thermal detector has elongated parallel thermal isolation stots 62 along one axis. The elongated parallel slots 62 improve the acuity, or MTF of the resulta...
02/11/1997
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