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Inventor: Hideyuki Yamakoshi


Address: Osaka, JP
No. of patents: 1
Last patent issue date: 12/04/2012

NumberTitleIssue Date
8324299Moisture-curable hot melt adhesive
A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adh...
12/04/2012
 
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