Celebrity Inventors
Magician Harry Houdini patented a "Diver's Suit" enabling the wearer to "quickly divest himself of the suit while being submerged and to safely escape and reach the surface of the water."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7531383 | Array quad flat no-lead package and method of forming same An array QFN package (10) includes a first semiconductor package (12) and a lead frame (14) having a plurality of leads (16). A first IC die (22) is attached on a first side to the first semiconductor package (12) and is ele... | 05/12/2009 |
| 7494924 | Method for forming reinforced interconnects on a substrate A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support structure to form an interconnect. The interconnect can reach a height... | 02/24/2009 |
| 7384819 | Method of forming stackable package A method of forming a semiconductor package (50 and 52) includes providing a substrate (14) having a die pad and bond pads on a first surface (20) and conductive pads (66, 68 and 74) on a second surface (22). An integ... | 06/10/2008 |
| 7282395 | Method of making exposed pad ball grid array package A method of making an exposed-pad ball-grid array package (11) includes applying a conductive sheet (16) to an adhesive tape (18). Stamping the conductive sheet (16) to form a die pad (24) and separating the remainder (26) o... | 10/16/2007 |
