U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

"The man with a new idea is a crank until the idea succeeds."

Samuel Clemens

Make the Most of Our Site

See this month's Top Inventors and Most Cited Patents.

Stay on top of the latest innovations by subscribing to an RSS feed.

Registered users: Manage your profile.

Inventor: Harlan Lawler

Address: Milpitas, CA
No. of patents: 1
Last patent issue date: 09/20/1988

Number	Title	Issue Date
4772935	Die bonding process A process for bonding silicon die to a package. This process comprises the following steps: (a) providing to the back surface of the die an adhesion layer of material which exhibits superior adhesion to both the silicon die and a subsequently applied barr...	09/20/1988