Did You Know...
...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 8242575 | Thin-film device including a terminal electrode connected to respective end faces of conductor layers A thin-film device incorporates a device main body and four terminal electrodes. The device main body has four side surfaces. The terminal electrodes are disposed to touch respective portions of the side surfaces. The device main body includes a lower conductor laye... | 08/14/2012 |
| 8048228 | Masking apparatus and method of fabricating electronic component A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base... | 11/01/2011 |
| 7987590 | Method for manufacturing an electronic part An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin hav... | 08/02/2011 |
| 7973246 | Electronic component The invention is to provide an electronic component which can obtain the capacitance value of a capacitor element highly precisely. An electronic component has a lower conductor (first conductor) which is formed on a planarized layer of a substrate, a dielectric fil... | 07/05/2011 |
| 7905012 | Method for manufacturing electronic components A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut ex... | 03/15/2011 |
| 7883614 | Method of manufacturing electronic part and electronic part The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adh... | 02/08/2011 |
| 7859080 | Electronic component comprising a coil conductor and a capacity element The invention provides an electronic component which has an improved breakdown limit value of withstand voltage and improved insulation properties and which can be made compact and provided with a multiplicity of layers and a great capacity. The electronic component... | 12/28/2010 |
| 7855460 | Electronic component to protect an interface between a conductor and an insulator and method for manufacturing the same An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conduct... | 12/21/2010 |
| 7683740 | Electronic component and method for manufacturing same An electronic component having: a substrate, a lower conductor layer provided on the substrate; an inorganic dielectric film that covers the lower conductor layer; and an upper conductor layer having an upper electrode portion provided on the inorganic dielectric fi... | 03/23/2010 |
| 7675136 | Thin-film device including a terminal electrode connected to respective end faces of conductor layers A thin-film device incorporates a device main body and four terminal electrodes. The device main body has four side surfaces. The terminal electrodes are disposed to touch respective portions of the side surfaces. The device main body includes a lower conductor laye... | 03/09/2010 |
| 7667951 | Electronic component The invention relates to an electronic component including a capacitor and provides an electronic component in which electromigration can be prevented and whose capacitor element has an accurate capacity value. The electronic component includes a bottom conductor fo... | 02/23/2010 |
| 7652349 | Thin-film device and method of manufacturing same A thin-film device comprises a substrate and a capacitor provided on the substrate. The capacitor incorporates: a lower conductor layer; a dielectric film a portion of which is disposed on the lower conductor layer; and an upper conductor layer disposed on the diele... | 01/26/2010 |
| 7649251 | Thin-film device A thin-film device incorporates: a substrate; an insulating layer, a plurality of lower conductor layers, a dielectric film, an insulating layer, a plurality of upper conductor layers and a protection film that are stacked in this order on the substrate; and a plura... | 01/19/2010 |
| 7608881 | Thin-film device and method of manufacturing same A thin-film device comprises: a substrate; a flattening film made of an insulating material and disposed on the substrate; and a capacitor provided on the flattening film. The capacitor incorporates: a lower conductor layer disposed on the flattening film; a dielect... | 10/27/2009 |
| 7589416 | Substrate, electronic component, and manufacturing method of these To fill a conductive material in an opening portion formed in a base of an electronic component, a groove is formed to surround an opening in an upper conductor, and the upper conductor is divided into a first conductive portion and a second conductive portion surro... | 09/15/2009 |
| 7586048 | Electronic component The invention relates to a surface mount type electronic component to be mounted on a printed circuit board or a hybrid IC (HIC) and provides a low-cost electronic component which is reliable in terms of heat resistance and pressure resistance. An inductor as the el... | 09/08/2009 |
| 7563342 | Method of manufacturing laminated substrate In a press process, a buffer member is placed on an RCC with a stainless steel plate between in such a way that the long sides and the short sides of the buffer member are aligned with the long sides and the short sides of the RCC respectively. The length of the lon... | 07/21/2009 |
| 7489036 | Thin-film device A thin-film device incorporates: a substrate; an insulating layer, a lower conductor layer, a dielectric film, an insulating layer, an upper conductor layer and a protection film that are stacked in this order on the substrate; and four terminal electrodes. The four... | 02/10/2009 |
| 7371682 | Production method for electronic component and electronic component A method of manufacturing an electronic part in which on the upper surface of an insulating member covering lower layer wiring, a conductor portion connected from the lower layer wiring is exposed. In this method, electric power supplying film is formed on the upper... | 05/13/2008 |
| 7321284 | Miniature thin-film bandpass filter A bandpass filter includes at least two thin-film layers, a first resonant circuit including a first inductor, and a second resonant circuit including a second inductor. In one embodiment, the first inductor comprises a coil having a counter-clockwise rotation posit... | 01/22/2008 |
| 6417026 | Acoustic wave device face-down mounted on a substrate In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to b... | 07/09/2002 |
| 6181015 | Face-down mounted surface acoustic wave device In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to b... | 01/30/2001 |
