Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 8361881 | Method for alternately contacting two wafers A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their ... | 01/29/2013 |
| 8330076 | Method and device for removing solder material deposits from a substrate The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material... | 12/11/2012 |
| 8328068 | Transfer device for receiving and transferring a solder ball arrangement The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the dischar... | 12/11/2012 |
| 8256131 | Method and device for drying circuit substrates Method and device for drying circuit substrates (13), in particular semiconductor substrates, in which a circuit surface (30) of the circuit substrate is flushed using a flushing liquid (10) in a flushing step and the circuit surface is dried in... | 09/04/2012 |
| 8205325 | Device for applying an electronic component The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently pos... | 06/26/2012 |
| 8087163 | Method of manufacturing a contact arrangement between a microelectronic component and a carrier The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by this method, whereby thermal energy required... | 01/03/2012 |
| 7932611 | Device for alternately contacting two wafers A method and device for alternately contacting two wafer-like component composite arrangements, in which the two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with thei... | 04/26/2011 |
| 7926699 | Method and device for transferring a solder deposit configuration Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25... | 04/19/2011 |
| 7882997 | Method and device for mutual contacting of two wafers A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14)... | 02/08/2011 |
| 7762446 | Method and device for transferring a solder deposit configuration Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25... | 07/27/2010 |
| 7726543 | Method for the production of a soldered joint A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 06/01/2010 |
| 7717316 | Method and device for applying a solder to a substrate A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by the action of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has... | 05/18/2010 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7106599 | Chip module and chip card module for producing a chip card The invention pertains to a chip module 20 and a method for producing a chip card module that comprises a chip module with a chip carrier 21 and a chip 22 that is contacted with strip conductors 25, 26 of the chip carrier, wherein the chi... | 09/12/2006 |
| 7087442 | Process for the formation of a spatial chip arrangement and spatial chip arrangement Process for the formation of a spatial chip arrangement having several chips (32, 36, 37, 38, 39) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (33) to as... | 08/08/2006 |
| 7049213 | Method for producing a contact substrate and corresponding contact substrate The invention relates to a method for producing a contact substrate (10) as well as to a contact substrate with through-plating between a connector arrangement (21) arranged at the top of a dielectric carrier substrate (12) and the underside of ... | 05/23/2006 |
| 6983539 | Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB... | 01/10/2006 |
| 6955943 | Method for producing a substrate arrangement A method is provided for producing a substrate arrangement. The process includes the preparation of a substrate and bringing connecting surfaces of the substrate into contact with inner contacts of a wiring layer, the application of contact material to outer contact... | 10/18/2005 |
| 6915940 | Device for applying solder globules An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposit... | 07/12/2005 |
| 6769599 | Method and device for placing and remelting shaped pieces consisting of solder material A method and a device for placing a multitude of shaped parts of solder material (20) on a bond pad arrangement (29) of a substrate (23), said bond pad arrangement comprising a multitude of bond pads (28), and for subsequent re-melting of... | 08/03/2004 |
| 6713714 | Method and device for thermally connecting the contact surfaces of two substrates A method and a device for thermally connecting the terminal areas (26, 27) of a contact substrate (11) to the terminal areas (28, 29) of a carrier substrate (12), where the substrates (11, 12) are, in order to produce the connectio... | 03/30/2004 |
| 6478906 | Method for bonding a flexible substrate to a chip Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy be... | 11/12/2002 |
| 6407457 | Contact-bumpless chip contacting method and an electronic circuit produced by said method An electronic contacting method for contacting a chip having a plurality of conductive contact areas, which are not provided with an additional metallization layer, a carrier substrate is provided, which has a first surface having arranged thereon a plura... | 06/18/2002 |
| 6397465 | Connection of electrical contacts utilizing a combination laser and fiber optic push connect system A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally ... | 06/04/2002 |
| 6284639 | Method for forming a structured metallization on a semiconductor wafer The present invention relates to a method of forming a structured metallization on a semiconductor wafer, wherein a main surface of the wafer has a passivation layer applied thereto, which is structured so as to determine at least one bond pad. Initially,... | 09/04/2001 |
| 6281577 | Chips arranged in plurality of planes and electrically connected to one another Process for the formation of a spatial chip arrangement having several chips (32, 36, 37, 38, 39) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (33) to assig... | 08/28/2001 |
| 6180434 | Method for producing a contactless chip card A method of producing a contactless chip card (10) includes first the step of holding a chip (14), which is provided with terminal pads (16a, 16b) on a surface thereof, in a mould defining a chip-card substrate (12), in such a way that the chip surface pr... | 01/30/2001 |
| 6160218 | Chip housing A housing to accept at least one electronic component, e.g., a chip with a cover and an opposing cover. The cover and opposing cover are formed to surround the component. On the inner surface of the cover and the opposing cover, there are conductive paths... | 12/12/2000 |
| 6107118 | Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way In a contact-bumpless chip contacting method for contacting a chip having a plurality of conductive contact areas, which are not provided with an additional metallization layer, a carrier substrate is provided, which has a first surface having arranged th... | 08/22/2000 |
| 6093971 | Chip module with conductor paths on the chip bonding side of a chip carrier Chip module (20) with a chip carrier (21) and at least one chip (22), wherein the chip carrier is designed as a sheet with a carrier layer (23) of plastics material and a conductor path structure (24) with conductor paths (28), and the chip carrier is con... | 07/25/2000 |
| 6072148 | Device for producing connections between two respective contact elements by means of laser energy A device for producing by means of laser energy a plurality of connections etween contact elements of respective contact element pairs has a holding arrangement for holding a plurality of optical fibers having respective optical fiber ends. A positioner is... | 06/06/2000 |
| 6059176 | Device and a method for applying a plurality of solder globules to a substrate A method for applying a plurality of solder globules to a substrate has a solder-globule fixing method, a plurality of glass fibers and a fibre holder. The solder-globule fixing method has provided therein a plurality of passages whose cross-sectional are... | 05/09/2000 |
| 6056188 | Method of attaching a component to a plate-shaped support A method of attaching an electronic component to a surface of a plate-shaped support member has as a first step the step of applying the electronic component to the surface of the support member, a solder being arranged between the electronic component an... | 05/02/2000 |
| 6043985 | Thermal connecting structure for connecting materials with different expansion coefficients A connecting structure (23) for establishing a thermal connection between at lest two components (21, 22) composed of materials with different expansion coefficients, wherein at least one component forms an electronic power element (21) and higher-melting... | 03/28/2000 |
| 5977512 | Multi-wavelength laser soldering device with substrate cleaning beam In a method and an apparatus for the flux-free application of a solder to a substrate or a chip an area on the surface of the substrate or on the pad of the chip, to which the solder is applied, is cleaned, to produce a sace which is suitable for solde... | 11/02/1999 |
| 5938951 | Method and apparatus for the bonding of a contact element Method and apparatus for bonding a contact element (17) on a substrate (20), in which the contact element is held by a connecting device designed, in particular, as a bonding head (11) and the contact element or the substrate or both are loaded with therm... | 08/17/1999 |
| 5653381 | Process and apparatus for producing a bonded metal coating A process and apparatus is available for producing a bonded metal coating. older material constructed so as to form a solder material shaped body (18) is transported by means of an energy transfer device (13), which is guided in a capillary tube (12) and w... | 08/05/1997 |
