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Inventor: Fei Guo


Address: Richmond Hill, CA
No. of patents: 2
Last patent issue date: 11/20/2012

NumberTitleIssue Date
8314474Under bump metallization for on-die capacitor
Various on-chip capacitors and methods of making the same are disclosed. In one aspect, a method of manufacturing a capacitor is provided that includes forming a first conductor structure on a semiconductor chip and forming a passivation structure on the first condu...
11/20/2012
8203395Wave guiding structures for crosstalk reduction
Various apparatus and methods of addressing crosstalk in a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first layer of a circuit board with a first signal trace and forming a second layer of the circuit bo...
06/19/2012
 
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