Did You Know...
...that the Band-Aid Bandage was invented by a Johnson & Johnson employee whose wife had cut herself? Earl Dickson's wife was rather accident prone, so he set out to develop a bandage that she could apply without help. He placed a small piece of gauze in the center of a small piece of surgical tape, and what we know today as the Band Aid bandage was born!
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| Number | Title | Issue Date |
| 8227295 | IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV A method of forming integrated circuit (IC) die configured for attachment to another die or a package substrate, and stacked IC devices therefrom. At least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV... | 07/24/2012 |
| 8039309 | Systems and methods for post-circuitization assembly A method of making integrated circuit packages using a conductive plate as a substrate includes forming a partial circuit pattern on one side of the conductive plate by stamping or selectively removing a portion of the conductive plate through part of its thickness,... | 10/18/2011 |
| 7918018 | Method of fabricating a semiconductor device In a method and apparatus for fabricating a semiconductor device having a flexible tape substrate, a hole is punched in the flexible tape substrate. The flexible tape substrate includes a metal layer attached to a polyimide layer without an adhesive there between. A... | 04/05/2011 |
| 7851928 | Semiconductor device having substrate with differentially plated copper and selective solder A semiconductor device having an insulating substrate with differentially plated metal and selective solder. Chip 221 with contact studs 223 is attached onto the traces 203 on tape 101. The traces, which are unprotected by soldermask 1... | 12/14/2010 |
| 7608916 | Aluminum leadframes for semiconductor QFN/SON devices A post-mold plated semiconductor device has an aluminum leadframe (105) with a structure including a chip mount pad and a plurality of lead segments without cantilevered lead portions. A semiconductor chip (210) is attached to the chip mount pad, and c... | 10/27/2009 |
| 7507605 | Low cost lead-free preplated leadframe having improved adhesion and solderability A leadframe with a structure made of a base metal (105), wherein the structure has a plurality of surfaces. On each of these surfaces are metal layers in a stack adherent to the base metal. The stack comprises a nickel layer (201) in contact with the b... | 03/24/2009 |
| 7504716 | Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking A semiconductor device comprising a semiconductor chip (101) assembled on a first copper cuboid (110); the cuboid has sides of a height (111). The device further has a plurality of second copper cuboids (120) suitable for wire bond attach... | 03/17/2009 |
| 7413974 | Copper-metallized integrated circuits having electroless thick copper bond pads A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystal... | 08/19/2008 |
| 7411303 | Semiconductor assembly having substrate with electroplated contact pads An apparatus comprising an insulating substrate having first and second surfaces and a plurality of metal-filled vias extending from the first to the second surface. The first and second surfaces have contact pads, each one comprising a connector stack to at least o... | 08/12/2008 |
| 7309909 | Leadframes for improved moisture reliability of semiconductor devices A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (402) and a plurality of lead segments (403). Covering the base metal are, consecutively, a nickel layer (3... | 12/18/2007 |
| 7268415 | Semiconductor device having post-mold nickel/palladium/gold plated leads A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end... | 09/11/2007 |
| 7245006 | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium fi... | 07/17/2007 |
| 7217656 | Structure and method for bond pads of copper-metallized integrated circuits A metal structure for a contact pad of a wafer or substrate (101), which have copper interconnecting traces (102) surrounded by a barrier metal layer (103). The wafer or substrate is protected by an insulating overcoat (104). In the struc... | 05/15/2007 |
| 7179738 | Semiconductor assembly having substrate with electroplated contact pads An apparatus comprising an insulating substrate (101) having first and second surfaces (101a, 101b) and a plurality of metal-filled vias (102) extending from the first to the second surface. The first and second surfaces hav... | 02/20/2007 |
| 7148085 | Gold spot plated leadframes for semiconductor devices and method of fabrication A leadframe for use with integrated circuit chips comprising a plated layer of gold selectively covering areas of said leadframe intended for solder attachment; and said gold layer providing a visual distinction to said areas. ... | 12/12/2006 |
| 6953986 | Leadframes for high adhesion semiconductor devices and method of fabrication A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium fi... | 10/11/2005 |
| 6915566 | Method of fabricating flexible circuits for integrated circuit interconnections A method for the fabrication of a double-sided electrical interconnection flexible circuit (200) particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs (203) is pressed through a dielectric film (... | 07/12/2005 |
| 6849806 | Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor An electrical apparatus having resistance to atmospheric effects includes at least one electrical device and a packaging structure. The packaging structure substantially encloses the at least one electrical device. The packaging structure includes a corrosion-resist... | 02/01/2005 |
| 6838757 | Preplating of semiconductor small outline no-lead leadframes For a leadframe for use with integrated circuit chips, a continuous strip of sheet-like base metal is pre-plated with a layer of nickel fully covering the base metal, further on one surface with a palladium layer in a thickness suitable for bonding wire attachment, ... | 01/04/2005 |
| 6828660 | Semiconductor device with double nickel-plated leadframe A leadframe for use in the assembly of integrated circuit (IC) chips, which has first and second surfaces and a base metal structure (606) with an adherent layer (607) of nickel having a rough, non-reflecting surface covering the base metal. This rough... | 12/07/2004 |
| 6724070 | Fine pitch lead frame A lead frame including a first set of leads in a first plane and a second set of leads in a second plane offset vertically from the second plane. The leads in the first and second planes are offset from each other by a lead width. ... | 04/20/2004 |
| 6683380 | Integrated circuit with bonding layer over active circuitry An integrated circuit device (10) with a bonding surface (12) directly over its active circuitry, and a method of making such integrated circuits (FIGS. 2A-2E). To make the bonding surface (12), a wafer (20) is provided with vias (24) to its metallization... | 01/27/2004 |
| 6545342 | Pre-finished leadframe for semiconductor devices and method of fabrication A leadframe for use with integrated circuit chips comprising a base metal, usually copper or a copper alloy, having a modified surface adapted to provide bondability and solderability and adhesion to polymeric compounds. The modified surface comprises a l... | 04/08/2003 |
| 6545344 | Semiconductor leadframes plated with lead-free solder and minimum palladium A leadframe for use with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering said base metal; a plated layer of lead-free solder on said nickel layer, selectively covering areas of said leadframe intended for at... | 04/08/2003 |
| 6429050 | Fine pitch lead frame and method The invention is a lead frame that has leads formed in two levels during the etching process in which the lead frame is formed. A lead frame form (40), or continuous strip of lead frame material, is coated on two sides with a photo resist material (41,43)... | 08/06/2002 |
| 6376901 | Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication A leadframe for use with integrated circuit chips Comprising a base metal having a plated layer of nickel fully covering said base metal; a plated layer of palladium on said nickel layer, selectively covering areas of said leadframe intended for bonding w... | 04/23/2002 |
| 6365974 | Flex circuit substrate for an integrated circuit package A double sided electrical connection flexible circuit particularly useful as a substrate for an area array integrated package, and the method of fabricating the structure is described. A circuit having interconnections on one surface and solder ball conta... | 04/02/2002 |
| 6337445 | Composite connection structure and method of manufacturing A bump connection structure and a method of attachment to integrated circuits or packages is provided which comprises a prefabricated core structure coated with solderable metal layers to form a composite bump. Said composite bump is aligned to contact pa... | 01/08/2002 |
| 6194777 | Leadframes with selective palladium plating A leadframe having the desirable features of palladium plated leadframes, such as compatibility with both wire bonding and solder reflow, as well as good adhesion to molding compounds is provided by plating the interior lead frame portions with one microi... | 02/27/2001 |
| 6180999 | Lead-free and cyanide-free plating finish for semiconductor lead frames A lead frame lead and method of fabrication of the leadframe. A leadframe is formed from one of copper or copper-based material having a layer of an alloy of palladium and nickel and a coating of palladium formed over the alloy on the leadframe. The coati... | 01/30/2001 |
| 6153518 | Method of making chip size package substrate A method of fabricating an electrically conductive via in a substrate which includes providing an electrically insulating substrate having first and second opposing surfaces and forming a first layer of electrically conductive material on the first of the... | 11/28/2000 |
| 6144100 | Integrated circuit with bonding layer over active circuitry An integrated circuit device (10) with a bonding surface (12) directly over its active circuitry, and a method of making such integrated circuits (FIGS. 2A 2E). To make the bonding surface (12), a wafer (20) is provided with vias (24) to its metallization... | 11/07/2000 |
| 6080494 | Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array A method of fabricating a ball grid array and the array. The method comprises the steps of providing an electrically insulating substrate and forming an essentially gold-free solder ball attach region and wire bond region secured to the substrate. Formati... | 06/27/2000 |
| 5989935 | Column grid array for semiconductor packaging and method A method for manufacturing a column grid array semiconductor package (10, 210) may include the steps of providing a substrate material (14, 114, 214) having a first side (16, 116) and a second side (18), forming a plurality of holes (36, 136, 236) in the ... | 11/23/1999 |
| 5935719 | Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes A leadframe and method of fabrication of the leadframe. A leadframe is formed from one of copper or copper-based material and a coating of palladium is formed over the leadframe. Optionally, a layer of from about 10 to about 95 percent copper by weight an... | 08/10/1999 |
| 5731041 | Method for producing silicon coating having high surface area The invention is to a method for producing a high surface substrate. A mask is positioned (31) over a substrate to define a deposition area. Thereafter at least two dissimilar materials are simultaneously deposited (32) through the mask onto the depositio... | 03/24/1998 |
| 5710456 | Silver spot/palladium plate lead frame finish A lead frame is plated with palladium and then selected portions of the lead frame leads are spot plated with silver to improve solderability.... | 01/20/1998 |
| 5672915 | Ceramic coated plastic package The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic material is applied over a plastic packaged semiconductor device to seal the package from moisture.... | 09/30/1997 |
| 5633528 | Lead frame structure for IC devices with strengthened encapsulation adhesion This invention relates to lead flames upon which chips (A or B) are mounted prior to encapsulation during IC device packaging. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) an... | 05/27/1997 |
| 5561320 | Silver spot/palladium plate lead frame finish A lead frame is plated with palladium and then selected portions of the lead frame leads are spot plated with silver to improve solderability.... | 10/01/1996 |
