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Inventor: Chan Gyun Shin


Address: Uiwang-si, KR
No. of applications: 1
Last application issue date: 06/30/2011

Application No.Application TitleIssue Date
20110155948Polyamide Based Resin Composition Having Excellent Whiteness, Thermal Conductivity, and Extruding Moldability
The present invention provides a polyamide resin composition that can have good whiteness, thermal conductivity and extrusion molding properties, which includes (A) polyamide resin; (B) heat conductive filler; (C) filler; and (D) thermoplastic resin which is miscible wi...
06/30/2011
 
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