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Inventor: Bruno Ryrko

Address: Denslingen, DE
No. of patents: 1
Last patent issue date: 09/04/1990

Number	Title	Issue Date
4953834	Pendulum with bending spring joint A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such sprin...	09/04/1990