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| Number | Title | Issue Date |
| 7856341 | Heat sink Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink,... | 12/21/2010 |
| 7795724 | Sandwiched organic LGA structure An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifi... | 09/14/2010 |
| 7742315 | Circuit on a printed circuit board The present invention relates to computer hardware design, and in particular to a printed circuit board (card) comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In particular a... | 06/22/2010 |
| 7709951 | Thermal pillow Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a fl... | 05/04/2010 |
| 7355125 | Printed circuit board and chip module The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In order to provide a p... | 04/08/2008 |
| 7255571 | Temperature dependent semiconductor module connectors A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to t... | 08/14/2007 |
| 7137826 | Temperature dependent semiconductor module connectors A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to t... | 11/21/2006 |
| 7128579 | Hook interconnect Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are ad... | 10/31/2006 |
| 7109722 | Apparatus and method for PCB smoke and burn detection and prevention An apparatus and method for at least one of detecting and preventing burning of a PCB is disclosed. The method includes configuring a first comb array defined by a plurality of first fingers at a first potential; configuring a second comb array defined by a pluralit... | 09/19/2006 |
| 6894228 | High performance dense wire for printed circuit board A method and structure for implementing dense wiring, in printed circuit board or chip carrier applications, which provides superior electrical characteristics while preserving the system resistance and characteristic impedance requirements. The dense wiring is char... | 05/17/2005 |
| 6495772 | High performance dense wire for printed circuit board A method and structure for implementing dense wiring, in printed circuit board or chip carrier applications, which provides superior electrical characteristics while preserving the system resistance and characteristic impedance requirements. The dense wir... | 12/17/2002 |
