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| Application No. | Application Title | Issue Date |
| 20120267074 | COOLING DEVICE A cooling device includes a base, first and second heat generating parts connected to the base, first and second passages formed in the base and a partition wall disposed in the base. Liquid refrigerant flows through the first and the second passages for cooling the fir... | 10/25/2012 |
| 20120182695 | SEMICONDUCTOR DEVICE A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitionin... | 07/19/2012 |
| 20120182692 | DOUBLE-SIDED SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR THE SAME A double-sided substrate includes a ceramic substrate, a first metal layer formed on one surface of the ceramic substrate and having a plurality of subsidiary metal layers which are laminated on the surface of the ceramic substrate and whose purities differ from each ot... | 07/19/2012 |
| 20120175765 | SEMICONDUCTOR DEVICE A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitionin... | 07/12/2012 |
| 20120126390 | SEMICONDUCTOR DEVICE A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink direct... | 05/24/2012 |
| 20110235279 | COOLING DEVICE A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to ... | 09/29/2011 |
| 20110232316 | COOLING DEVICE A cooling device includes a refrigerant inlet, a refrigerant outlet, a cooler including therein a refrigerant passage, an introduction tube communicating with the refrigerant inlet and a filter detachably disposed between the refrigerant inlet and the introduction tube.... | 09/29/2011 |
| 20100193941 | SEMICONDUCTOR DEVICE A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed t... | 08/05/2010 |
