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Inventor: Niklas Svedin


Address: Stockholm, SE
No. of applications: 3
Last application issue date: 01/26/2012

Application No.Application TitleIssue Date
20120019886VIA STRUCTURE AND METHOD THEREOF
A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated con...
01/26/2012
20120018898VIA STRUCTURE AND METHOD THEREOF
The invention relates to a layered micro-electronic and/or micro-mechanic structure, comprising at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via ...
01/26/2012
20120018852VIA STRUCTURE AND METHOD THEREOF
A vent hole precursor structure (26) in an intermediate product for a semi-conductor device has delicate structures (27, 28), and said intermediate product has a cavity (21) with a pressure therein differing from the pressure of the surroundings. Th...
01/26/2012
 
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