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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Application No. | Application Title | Issue Date |
| 20110203347 | SENSING MODULES AND METHODS OF USING A sensing module and method for monitoring various physical parameters, and particularly environmental parameters to which a living body may be subjected, for example, impacts and shock wave pulses. The module at least one energy storage device and at least one set of e... | 08/25/2011 |
| 20110009773 | IMPLANTABLE SENSING MODULES AND METHODS OF USING Implantable sensing modules and methods for monitoring various physical parameters, including physical parameters of a living body and environmental parameters to which the living body may be subjected, for example, impacts. A method for monitoring impacts to which a li... | 01/13/2011 |
| 20100072555 | WAFER BONDING METHOD AND WAFER STACK FORMED THEREBY A wafer bonding process that compensates for curvatures in wafer surfaces, and a wafer stack produced by the bonding process. The process entails forming a groove in a surface of a first wafer, depositing a bonding stack on a surface of a second wafer, aligning and mati... | 03/25/2010 |
| 20100040113 | METHOD AND SYSTEM FOR MONITORING ENVIRONMENTAL CONDITIONS A sensing system, sensing method, and method of producing a sensing system capable of providing a cumulative measurement capability, such as in the form of a RFID tag capable of measuring cumulative heat and humidity for continuous monitoring of storage and shipping con... | 02/18/2010 |
| 20080188059 | INTEGRATED SENSOR AND CIRCUITRY AND PROCESS THEREFOR A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to defin... | 08/07/2008 |
| 20080053236 | CAPACITIVE PRESSURE SENSOR AND METHOD THEREFOR A capacitive pressure sensor and method for its fabrication. The sensor is fabricated from first and second wafers to have a mechanical capacitor comprising a fixed electrode and a moving electrode defined by a conductive plate. The sensor further has a diaphragm on a s... | 03/06/2008 |
| 20080054756 | BIMORPHIC STRUCTURES, SENSOR STRUCTURES FORMED THEREWITH, AND METHODS THEREFOR A bimorphic structure responsive to changes in an environmental condition, sensor structures incorporating one or more of such bimorphic structures, and a method of forming such bimorphic structures. The sensor structure has an electrically-conductive first contact on a... | 03/06/2008 |
| 20080053229 | THREE-AXIS INERTIAL SENSOR AND METHOD OF FORMING A three-axis inertial sensor and a process for its fabrication using an silicon-on-oxide (SOI) wafer as a starting material. The SOI wafer has a first conductive layer separated from a second conductive layer by an insulative buried oxide (BOX) layer. The SOI wafer is f... | 03/06/2008 |
| 20070273463 | MICRO-ELECTRO-MECHANICAL MODULE A MEMS module that contains at least one integrated energy storage device whose discharge is minimized and controlled, so that power is available for system operation over longer periods of time. The MEMS module includes a device electrically coupled to the energy stora... | 11/29/2007 |
| 20070029629 | INTEGRATED SENSOR AND CIRCUITRY AND PROCESS THEREFOR A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to defin... | 02/08/2007 |
