Inventor: Naoya Hirakawa

Address: Kumamoto, JP
No. of applications: 2
Last application issue date: 05/12/2005

Application No.	Application Title	Issue Date
20050100679	Substrate processing method and substrate processing system The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating so...	05/12/2005
20050087129	Reduced-pressure drying unit and coating film forming method The invention includes a hermetic container provided with a substrate mount; a vacuum exhauster connected to the hermetic container; a current member; and a current member raising and lowering mechanism. When the current member is raised and lowered as a function of the...	04/28/2005

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