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Inventor: Kazuyuki Nakanishi


Address: Seto-shi, Aichi, JP
No. of applications: 1
Last application issue date: 03/16/2006

Application No.Application TitleIssue Date
20060057768Semiconductor element heat dissipating member, semiconductor device using same and manufacturing same
A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing...
03/16/2006
 
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