Bizarre Patents
Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Application No. | Application Title | Issue Date |
| 20130015495 | Stacked Half-Bridge Power Module According to an exemplary embodiment, a stacked half-bridge power module includes a high side device having a high side power terminal coupled to a high side substrate and a low side device having a low side power terminal coupled to a low side substrate. The high side ... | 01/17/2013 |
| 20120314372 | Power Semiconductor Package with Double-Sided Cooling According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The power semiconductor package also includes a double-sided heat sink with a t... | 12/13/2012 |
| 20120275121 | Power Module with Press-Fit Clamps According to an exemplary embodiment, a bondwireless power module residing on a top surface of a substrate includes at least one input power pad providing power to the module and at least one output current pad providing output current from the module. At least one pres... | 11/01/2012 |
| 20120262100 | Bondwireless Power Module with Three-Dimensional Current Routing According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device. The bondwireless power module also includes a high side conductive clip ... | 10/18/2012 |
| 20120248564 | Dual Compartment Semiconductor Package with Temperature Sensor According to an exemplary embodiment, a dual compartment semiconductor package includes a conductive clip having first and second compartments. The first compartment is electrically and mechanically connected to a top surface of the first die. The second compartment ele... | 10/04/2012 |
| 20120001316 | Package for High Power Devices A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive... | 01/05/2012 |
| 20110316086 | Wafer Scale Package for High Power Devices A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive... | 12/29/2011 |
| 20070290311 | BOND WIRELESS POWER MODULE WIHT DOUBLE-SIDED SINGLE DEVICE COOLING AND IMMERSION BATH COOLING A wire bond free power module assembly consists of a plurality of individual thin packages each consisting of two DBC wafers which sandwich one or more semiconductor die. The die electrodes and terminals extend through one insulation covered end of the wafer sandwich an... | 12/20/2007 |
| 20070273009 | HIGHLY EFFICIENT BOTH-SIDE-COOLED DISCRETE POWER PACKAGE, ESPECIALLY BASIC ELEMENT FOR INNOVATIVE POWER MODULES Two DBC wafers have patterned first conductive surfaces which receive a semiconductor die in sandwich fashion. Lead frame terminally extending into the package interior and are connected to the die terminals. The outer conductive surfaces of each of the wafers are avail... | 11/29/2007 |
| 20070257343 | DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION A high voltage semiconductor module has a leadframe with spaced pads which is connected to a heat sink plate by a curable insulation layer on the top of the plate. Semiconductor die may be soldered to the leadframe pads before or after assembly to the plate. The insulat... | 11/08/2007 |
| 20070138651 | Package for high power density devices A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive... | 06/21/2007 |
