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Patent No. 5205055

Pneumatic Shoe Lacing Apparatus

This invention provides a pneumatic shoe lacing apparatus for the pneumatic lacing of shoe.

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Inventor: David R. Greenberg


Address: White Plains, NY
No. of applications: 8
Last application issue date: 07/29/2010

Application No.Application TitleIssue Date
20100187607LOW COST FABRICATION OF DOUBLE BOX BACK GATE SILICON-ON-INSULATOR WAFERS WITH BUILT-IN SHALLOW TRENCH ISOLATION IN BACK GATE LAYER
A semiconductor wafer structure for manufacturing integrated circuit devices includes a bulk substrate; a lower insulating layer formed on the bulk substrate, the lower insulating layer formed from a pair of separate insulation layers having a bonding interface therebet...
07/29/2010
20100176453LOW COST FABRICATION OF DOUBLE BOX BACK GATE SILICON-ON-INSULATOR WAFERS WITH BUILT-IN SHALLOW TRENCH ISOLATION IN BACK GATE LAYER
A semiconductor wafer structure for manufacturing integrated circuit devices includes a bulk substrate; a lower insulating layer formed on the bulk substrate, the lower insulating layer formed from a pair of separate insulation layers having a bonding interface therebet...
07/15/2010
20100176482LOW COST FABRICATION OF DOUBLE BOX BACK GATE SILICON-ON-INSULATOR WAFERS WITH SUBSEQUENT SELF ALIGNED SHALLOW TRENCH ISOLATION
A semiconductor substrate structure for manufacturing integrated circuit devices includes a bulk substrate; a lower insulating layer formed on the bulk substrate, the lower insulating layer formed from a pair of separate insulation layers having a bonding interface ther...
07/15/2010
20080124881INCORPORATION OF CARBON IN SILICON/SILICON GERMANIUM EPITAXIAL LAYER TO ENHANCE YIELD FOR Si-Ge BIPOLAR TECHNOLOGY
A SiGe bipolar transistor containing substantially no dislocation defects present between the emitter and collector region and a method of forming the same are provided. The SiGe bipolar transistor includes a collector region of a first conductivity type; a SiGe base re...
05/29/2008
20070241428TRANSISTOR STRUCTURE WITH MINIMIZED PARASITICS AND METHOD OF FABRICATING THE SAME
A transistor having minimized parasitics is provided including an emitter having a recessed extrinsic emitter portion atop an intrinsic emitter portion; a base including an intrinsic base portion in electrical contact with the intrinsic emitter portion and an extrinsic ...
10/18/2007
20060249814Transistor structure with minimized parasitics and method of fabricating the same
A transistor having minimized parasitics is provided including an emitter having a recessed extrinsic emitter portion atop an intrinsic emitter portion; a base including an intrinsic base portion in electrical contact with the intrinsic emitter portion and an extrinsic ...
11/09/2006
20050191911Transistor structure with minimized parasitics and method of fabricating the same
A transistor having minimized parasitics is provided including an emitter having a recessed extrinsic emitter portion atop an intrinsic emitter portion; a base including an intrinsic base portion in electrical contact with the intrinsic emitter portion and an extrinsic ...
09/01/2005
20050054171Incorporation of carbon in silicon/silicon germanium epitaxial layer to enhance yield for Si-Ge bipolar technology
A SiGe bipolar transistor containing substantially no dislocation defects present between the emitter and collector region and a method of forming the same are provided. The SiGe bipolar transistor includes a collector region of a first conductivity type; a SiGe base re...
03/10/2005
 
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