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| Number | Title | Issue Date |
| 4046660 | Sputter coating with charged particle flux control Substrate heating during sputter coating, due to charged particles, is controlled by the use of an auxiliary magnet in the vicinity of the substrate. The magnet is arranged to either increase this charge particle flux, in situations in which additional he... | 09/06/1977 |
| 4039698 | Method for making patterned platinum metallization A method is disclosed for making precisely patterned platinum films in the manufacture of integrated circuit devices. The method calls for the deposition of a film of a platinum compound, whose heat of formation is in the range of from -100 to +10 Kcal/mo... | 08/02/1977 |
| 4022930 | Multilevel metallization for integrated circuits The specification describes a procedure for multilevel metallization of semiconductor integrated circuits in which the severity of the step formed by the edges of the first level pattern and the intermediate insulator over which the second level metalliza... | 05/10/1977 |
| 3975252 | High-resolution sputter etching High-resolution sputter etching of a relatively thick layer (of, for example, gold) by directly utilizing a relatively thin layer of resist as a sputter-etching mask is often not feasible. In such a case, it is known to use a sputter-etching mask made of ... | 08/17/1976 |
| 3949131 | Photomasks with antistatic control In high resolution lithography, resolution impairment sometimes occurs due to dust collecting on the mask. The dust is often attracted to the mask by static electricity. The solution proposed is to coat the entire photomask with a transparent, electricall... | 04/06/1976 |
