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Inventor: Chu-Wei Cheng

Address: Pingjhen, TW
No. of patents: 1
Last patent issue date: 06/08/2010

Number	Title	Issue Date
7732299	Process for wafer bonding The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a top metal layer on a first substrate, in which the top metal layer has a plurality of interconnect features and a first dummy feature; forming a first di...	06/08/2010