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Inventor: Cheol-hong Kim


Address: Suwon, KR
No. of patents: 7
Last patent issue date: 11/02/1999

NumberTitleIssue Date
5978138Projection exposure systems
A projection method uses a modified illumination method for a lithography process of semiconductor device, and a projection system and mask use the projection method. An object is exposed by removing the vertical incident component of light passed through...
11/02/1999
5808796Projection method and projection system and mask therefor
A projection method uses a modified illumination method for a lithography process of semiconductor device, and a projection system and mask use the projection method. An object is exposed by removing the vertical incident component of light passed through...
09/15/1998
5726738Aperture for off-axis illumination and projection exposure apparatus employing the same
An aperture for an off-axis illumination (OAI) and a projection exposure apparatus which employs the same. In the aperture for an OAI having a light-intercepting region and a light-transmitting region, at least a portion of the light-transmitting region i...
03/10/1998
5661601Projection method and projection system and mask therefor
A projection method uses a modified illumination method for a lithography process of semiconductor device, and a projection system and mask use the projection method. An object is exposed by removing the vertical incident component of light passed through...
08/26/1997
5608576Projection method and projection system and mask therefor
A projection method uses a modified illumination method for a lithography process of semiconductor device, and a projection system and mask use the projection method. An object is exposed by removing the vertical incident component of light passed through...
03/04/1997
5446587Projection method and projection system and mask therefor
A projection method uses a modified illumination method for a lithography process of semiconductor device, and a projection system and mask use the projection method. An object is exposed by removing the vertical incident component of light passed through...
08/29/1995
5427649Method for forming a pattern by silylation
A method for forming a mask pattern using a multi-layer photoresist film process is disclosed. The processing is simplified from known processes by using a silylated photoresist film. A first photoresist layer is formed on substrate and part of the surfac...
06/27/1995
 
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