| Patent No. | Patent Title: |
| 7211889 | Semiconductor package and method for manufacturing the same |
| 6974765 | Encapsulation of pin solder for maintaining accuracy in pin posit... |
| 6838770 | Semiconductor device, designing method and designing device there... |
| 6806558 | Integrated segmented and interdigitated broadside- and edge-coupl... |
| 6740582 | Integrated circuits and methods for their fabrication |
| 6737720 | Packaging structure of image sensor and method for packaging the ... |
| 6734528 | Transistor with pi-gate structure and method for producing the sa... |
| 6734535 | Semiconductor device, method of manufacture thereof, circuit boar... |
| 6724095 | Apparatus for aligning an integrated circuit package with an inte... |
| 6720662 | Semiconductor device of chip-on-chip structure with a radiation n... |
| 6720207 | Leadframe, resin-molded semiconductor device including the leadfr... |
| 6720642 | Flip chip in leaded molded package and method of manufacture ther... |
| 6713848 | Output stage layout for minimum cross coupling between channels |
| 6710458 | Tape for chip on film and semiconductor therewith |
| 6710464 | Resin mold semiconductor device |
| 6710438 | Enhanced chip scale package for wire bond dies |
| 6710434 | Window-type semiconductor package and fabrication method thereof |
| 6710461 | Wafer level packaging of micro electromechanical device |
| 6707146 | Semiconductor apparatus with decoupling capacitor |
| 6707108 | Transient voltage suppressor structure |
| 6707137 | Semiconductor package and method for fabricating the same |
| 6707124 | HID land grid array packaged device having electrical and optical... |
| 6704206 | Assembly device and method for assembling an electronic component |
| 6703699 | Semiconductor device |
| 6700186 | Lead frame for a semiconductor device, a semiconductor device mad... |
| 6700187 | Semiconductor package and method for manufacturing the same |
| 6689640 | Chip scale pin array |
| 6683385 | Low profile stack semiconductor package |
| 6680544 | Flip-chip bump arrangement for decreasing impedance |
| 6680523 | Semiconductor wafer with process control modules |
| 6674159 | Bi-level microelectronic device package with an integral window |
| 6674143 | Hermetically sealing package for optical semiconductor and optica... |
| 6670215 | Semiconductor device and manufacturing method thereof |
| 6664622 | Header for electronic components board in surface mount and throu... |
| 6664643 | Semiconductor device and method for manufacturing the same |
| 6664616 | Semiconductor device and manufacturing method thereof |
| 6661084 | Single level microelectronic device package with an integral wind... |
| 6661081 | Semiconductor device and its manufacturing method |
| 6657282 | Semiconductor device having a ball grid array and a fabrication p... |
| 6657296 | Semicondctor package |
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