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| Number | Title | Issue Date |
| 8184444 | Electrode pad for mounting electronic component and structure for mounting electronic component Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode p... | 05/22/2012 |
| 8184448 | Bare chip embedded PCB A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at ... | 05/22/2012 |
| 8184447 | Multi-layer electronic part built-in board A versatile multi-layer electronic part built-in board compatible with different external circuits to be connected thereto is provided. Sensors are connected to a connector through connection lines that are connected to electronic parts. The electronic parts are dir... | 05/22/2012 |
| 8179688 | Semiconductor device An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are dispos... | 05/15/2012 |
| 8179687 | Signal transmission device with single output configuration and related motherboard A signal transmission device is installed on a motherboard and is electrically connected to a signal control unit and a display output interface. The signal transmission device includes a signal receiving port, a signal output port, and a printed circuit connecting ... | 05/15/2012 |
| 8179693 | Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements Apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched be... | 05/15/2012 |
| 8171622 | Flexible printed circuit and method for manufacturing the same Disclosed is a flexible printed circuit, comprising a substrate, and a silver foil and a reinforcement plate attached on said substrate in order, wherein there is an ink layer between said silver foil and said reinforcement plate. According to the invention, by prin... | 05/08/2012 |
| 8174841 | Adaptive interconnect structure An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin m... | 05/08/2012 |
| 8174843 | Printed circuit board A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power ... | 05/08/2012 |
| 8174842 | Light-emitting diode module A light-emitting diode (LED) module includes a plurality of LED units and a converter having a first side. The LED units respectively include a circuit board having a second side perpendicular to the first side and a third side parallel to the first side, a pluralit... | 05/08/2012 |
| 8174845 | Electronic apparatus cover The purpose of the present invention is providing an electronic apparatus cover easily detached in the electronic apparatus cover that protects a connector installed in a recess portion of the electronic apparatus. The present invention is an electronic apparatus co... | 05/08/2012 |
| 8169784 | Circuit module To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second subst... | 05/01/2012 |
| 8169790 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, sta... | 05/01/2012 |
| 8169792 | Multilayer printed wiring board A multilayer printed wiring board includes: a build-up layer that is formed on a core substrate and has a conductor pattern disposed on an upper surface; a low elastic modulus layer that is formed on the build-up layer; lands that are disposed on an upper surface of... | 05/01/2012 |
| 8164920 | Printed wiring board A printed wiring board includes a mounting portion on which a dual core processor including two processor cores in a single chip can be mounted, power supply lines, ground lines, and a first layered capacitor and a second layered capacitor that are independently pro... | 04/24/2012 |
| 8164915 | System for electronic components mounted on a circuit board A system for electronic components mounted on a circuit board is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conduct... | 04/24/2012 |
| 8164906 | Modular electronic enclosure A modular electronic enclosure having a maximum height of 1 U and a width adapted to fit between the rails of a 19 inch rack is adapted to receive up to ten single-width Advanced Mezzanine Cards (AMCs) installed horizontally in the enclosure. Some modules that are n... | 04/24/2012 |
| 8159825 | Method for fabrication of electrical contacts to superconducting circuits A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of ... | 04/17/2012 |
| 8159832 | Electromagnetic band gap structures and method for making same A folded EBG structure has a plurality of cells arranged in a two-dimensional array. Each of the cells has an electrically conductive patch and an electrically conductive via coupled between the patch and a ground plane. In one dimension of the folded EBG structure,... | 04/17/2012 |
| 8159828 | Low profile flip chip power module and method of making A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit lamin... | 04/17/2012 |
| 8154879 | Motherboard A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in ... | 04/10/2012 |
| 8149133 | MUX BOP database mirroring An apparatus to remotely archive data from a blowout preventer includes a first system controller in communication with the blowout preventer and a communications network, and a second system controller in communication with the blowout preventer and the communicati... | 04/03/2012 |
| 8149588 | Circular electronic apparatus The present invention provides a circular electronic apparatus. The circular electronic apparatus includes a circular crust and a plurality of isosceles trapezoid circuit boards. The isosceles trapezoid circuit boards are put together to form an equilateral polygon.... | 04/03/2012 |
| 8149565 | Circuit board device and integrated circuit device A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second po... | 04/03/2012 |
| 8144479 | Wireless communication module A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame sp... | 03/27/2012 |
| 8134841 | Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment According to one embodiment, there is provided a printed-wiring board, includes a first base member including a component mounting face, a first electronic component with a through-electrode mounted on the component mounting face, a second base member stacked on the... | 03/13/2012 |
| 8130504 | Method of manufacturing a flexible printed circuit board, an optical transmitter receiver module, and an optical transmitter receiver A method of manufacturing a flexible printed circuit board having an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exteri... | 03/06/2012 |
| 8125761 | Capacitor devices with co-coupling electrode planes A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the f... | 02/28/2012 |
| 8125787 | Frame assembly for touch screen The frame assembly mainly contains a number of linear edge members and a number of L-shaped corner members end-to-end joining the edge members by a number of connection pieces into a rectangular frame surrounding a touch panel. Both the edge and corner members have ... | 02/28/2012 |
| 8125788 | Circuit module and radio communications equipment, and method for manufacturing circuit module An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13, and a semiconductor component 4 are mounted on a wiring board 2, and are covered with an insulating resi... | 02/28/2012 |
| 8125794 | Multilayer printed wiring board and electronic device using the same The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the ... | 02/28/2012 |
| 8125058 | Faraday cage for circuitry using substrates An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device. For example, the first Faraday cage portion may include a first conductive portion of a Faraday c... | 02/28/2012 |
| 8120928 | Electronic device with a fixing member An electronic device includes an enclosure and a fixing member to secure the enclosure to a fastener. The receiving member defines a first receiving portion and a second receiving portion in communication with the first receiving portion. The fixing member includes ... | 02/21/2012 |
| 8120925 | Circuit device A circuit device includes a dielectric substrate including a first face and a second face opposite side of the first face; a coplanar line including a first line, a second line and ground electrodes, the first line and the second line being decupled mutually, the gr... | 02/21/2012 |
| 8115105 | Prepreg and its application products for low thermal expansion and low dielectric tangent A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the ther... | 02/14/2012 |
| 8116091 | Printed circuit board A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure h... | 02/14/2012 |
| 8116097 | Apparatus for electrically coupling a semiconductor package to a printed circuit board An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The pl... | 02/14/2012 |
| 8111524 | Electronic passive device A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face an... | 02/07/2012 |
| 8107253 | Printed circuit board A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating lay... | 01/31/2012 |
| 8107254 | Integrating capacitors into vias of printed circuit boards A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole characterized by a generally tubular inner surface; a capacitor i... | 01/31/2012 |
